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A kind of laser spiral scanning blind hole manufacturing method

A helical scanning and manufacturing method technology, which is applied in the direction of manufacturing tools, laser welding equipment, metal processing equipment, etc., can solve the problems of uneven depth of the bottom, depression in the central area, etc., and achieve the effect of small depth difference and uniform distribution of the bottom surface

Active Publication Date: 2022-07-19
XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of uneven bottom depth and depression in the central area when laser machining blind holes, and provide a laser spiral scanning blind hole manufacturing method, which can realize laser machining of high-quality cylindrical blind holes

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  • A kind of laser spiral scanning blind hole manufacturing method
  • A kind of laser spiral scanning blind hole manufacturing method
  • A kind of laser spiral scanning blind hole manufacturing method

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Embodiment Construction

[0023] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention, and are not intended to limit the protection scope of the present invention.

[0024] Aiming at the technical bottleneck existing in the current laser processing of blind holes, the present invention provides a method for manufacturing a laser helical scanning blind hole. The method adjusts the laser power in real time according to the distribution of the helical scanning trajectory and the trajectory scanning speed, thereby solving the problem of the helical scanning laser drilling. There is a problem of uneven depth at the bottom of the hole. The method of the present invention controls the machining accuracy of the bottom surface of the blind hole according to the laser power. Compared with othe...

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Abstract

The invention provides a method for manufacturing a blind hole by laser spiral scanning, which solves the problems of uneven bottom depth and depression in the center area during laser processing of the blind hole. The method can realize the laser processing of high-quality cylindrical blind holes. In the method of the present invention, the laser processing head control unit sends the rotation command of the helical scanning laser processing head, and obtains the rotation position feedback values ​​of the upper deflection wedge and the lower deflection wedge in real time, and then the laser processing head control unit according to the current spiral line The laser power control command is sent to the laser control unit in real time, so as to change the power value of the laser according to the position of the helical scanning line, so that the laser power of the laser changes with the change of the diameter of the helical line in real time, so as to make the depth difference of the bottom surface of the processing. smaller. In addition, the motion mechanism is used to realize the layer-by-layer feeding of the helical scanning head during the processing, so as to realize the processing of blind holes of different depths of the workpiece.

Description

technical field [0001] The invention belongs to the field of laser precision manufacturing, and in particular relates to a method for manufacturing a blind hole of laser spiral scanning. Background technique [0002] Because laser processing has the characteristics of no cutting stress, high precision, and flexibility, it has been widely used in aerospace, electronics and other fields, and can achieve precision drilling of parts. However, due to the special physical characteristics of the laser processing beam (the focused beam has a certain depth of focus along the depth direction, that is, the Rayleigh length, within this range, material removal can be achieved), so laser drilling technology is often used. Through-hole processing is realized, while for the processing of blind holes, there are problems such as large difference in bottom depth and depression in the center area. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to solve the problems...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/386B23K26/064
CPCB23K26/386B23K26/0643
Inventor 李明江浩
Owner XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI