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Positioning device and grinding auxiliary system

A positioning device and auxiliary system technology, which is applied in the direction of grinding machine tools, grinding devices, manufacturing tools, etc., can solve the problems of horizontal deviation, cross-section data and real value deviation, large error, etc., and achieve the effect of convenient positioning and precise grinding

Active Publication Date: 2021-10-08
SUZHOU TF AMD SEMICON CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the center position of the bump is mainly determined by the visual method of an optical microscope, which has the disadvantages of large error, difficulty in precise positioning, and cumbersome operation, which leads to deviations between the obtained cross-section data and the real value; and the substrate bump during the grinding process The horizontal direction is not easy to control, and it is easy to deviate from the horizontal direction, making it impossible to accurately obtain the center section of the bump

Method used

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  • Positioning device and grinding auxiliary system
  • Positioning device and grinding auxiliary system
  • Positioning device and grinding auxiliary system

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Embodiment Construction

[0033] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0034] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0035] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "top", "bottom", "left", "right", "front", " Rear, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, Axial, Radial, Circumferential The orientation or posit...

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Abstract

The invention discloses a positioning device and a grinding auxiliary system. The positioning device comprises a first clamping piece, a second clamping piece and a distance adjusting assembly, wherein the first clamping piece and the second clamping piece are arranged in a spaced mode; clamping grooves are formed in the opposite faces of the first clamping piece and the second clamping piece correspondingly; a clamping space used for clamping a substrate is formed between the clamping grooves; the clamping space is provided with a first opening and a second opening in the extending directions of the clamping grooves; when the substrate is located in the clamping space and is in an unlocked state, the first side edge and the second side edge, parallel to the extending directions of the clamping grooves, of the substrate abut against the clamping grooves, and the third side edge, perpendicular to the extending directions of the clamping grooves, of the substrate is flush with the first opening; and the distance adjusting assembly is used for adjusting the position of the substrate in the clamping space in the extending directions of the clamping grooves. According to the positioning device provided by the invention, the center of a to-be-ground salient point of the substrate is accurately and conveniently positioned, and a foundation is laid for accurately obtaining the center section of the salient point of the substrate.

Description

technical field [0001] The present application generally relates to the technical field of semiconductor packaging, and specifically relates to a positioning device and a grinding auxiliary system. Background technique [0002] Interconnection bumps in microelectronic packaging play an important role in electrical connection, heat dissipation, and mechanical connection. The interconnection failure between component bumps and substrate bumps is one of the main factors leading to chip failure. Among them, substrate bumps The reliability directly affects the interconnection performance and determines the service life of electronic products. [0003] The central section of the substrate bump is often used to evaluate the reliability of the substrate bump. By measuring the width of the central section of the bump, the distance between the central section of the bump and the solder mask opening, and the size of the solder mask opening, and observing the bump Whether there are voi...

Claims

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Application Information

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IPC IPC(8): B24B37/27B24B37/005H01L21/68
CPCB24B37/27B24B37/005H01L21/68Y02E10/50
Inventor 韩俊刘永祥宁福英曾昭孔
Owner SUZHOU TF AMD SEMICON CO LTD
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