Imaging plane space correction method and device, and wafer measurement device
A measurement device and correction method technology, which is applied in image enhancement, image analysis, image data processing, etc., can solve problems such as measurement result errors, achieve the effects of reducing measurement result errors, improving measurement accuracy, and reducing distortion
Pending Publication Date: 2021-10-19
南京中安半导体设备有限责任公司
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Problems solved by technology
[0004] In view of this, the embodiments of the present application are dedicated to providing a correction method for the imaging plane space, a correction device thereof, and a wafer measurement device, so as to solve the problems caused by the existing optical problems of the interferometer in the imaging process in the wafer measurement device in the prior art. Distortion causes large errors in measurement results
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some, not all, embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0026] figure 1 A schematic flowchart of a method for correcting the imaging plane space in a wafer measurement device according to an embodiment of the present application is shown. Figures 2A-2C A schematic diagram showing different types of images corresponding to the top surface of a chuck provided according to an embodiment of the present application. The subject of execution of the calibration method may be a controller or a processor in the wafer measuring device, or a control system con...
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The embodiment of the invention provides an imaging plane space correction method and device and a wafer measurement device. The method comprises the steps: acquiring N standard coordinates corresponding to geometric centers of N holes, wherein N is a positive integer and is greater than 1; acquiring an image corresponding to the top surface of the chuck by using an interferometer; determining N measurement coordinates corresponding to geometric centers of the N holes according to the image; determining correction coordinates according to the N standard coordinates and the N measurement coordinates; and correcting the image according to the correction coordinates to obtain a corrected image. According to the embodiment of the invention, the correction coordinates are determined based on the N standard coordinates corresponding to the geometric centers of the N holes in the top surface of the chuck and in combination with the N measurement coordinates corresponding to the geometric centers of the N holes acquired by the interferometer, so the imaging plane space of the wafer measurement device is corrected by using the correction coordinates; therefore, the distortion in the image shot by the interferometer is reduced, and the error of the measurement result is reduced.
Description
technical field [0001] The present application relates to the technical field of wafer measurement devices, in particular to a method for correcting an imaging plane space, a correction device thereof, and a wafer measurement device. Background technique [0002] With the rapid development of the semiconductor industry, since wafers are important raw materials for semiconductor products, and the quality of wafers directly affects the quality of semiconductor products, higher requirements are placed on the quality of wafers. Wafer measurement setups for circular geometric parameters such as shape, warpage and / or flatness place higher demands. [0003] However, due to the optical distortion of the interferometer in the wafer measurement device during the imaging process, there will be a large error between the captured image and the actual image, which in turn will cause a large error in the measurement results based on image analysis , which will further affect the quality m...
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Login to View More IPC IPC(8): G06T7/00G06T5/00G06T7/62G06T7/70
CPCG06T7/0004G06T7/62G06T7/70G06T2207/30148G06T5/80
Inventor 唐寿鸿曾安陈建强
Owner 南京中安半导体设备有限责任公司