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Systems and methods for encapsulating electronic component

A technology for electronic components and packaging electronics, which is applied in chemical instruments and methods, electronic equipment, electrical components, etc., and can solve problems such as the undesired thickness of the packaging layer.

Pending Publication Date: 2021-10-19
HB FULLER CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Use of preformed films may result in undesired thickness of the encapsulation layer

Method used

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  • Systems and methods for encapsulating electronic component
  • Systems and methods for encapsulating electronic component
  • Systems and methods for encapsulating electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0093] The encapsulated article of Example 1 was prepared using a HARDO T150 application system (Hardo, Bad Salzburg, Germany) including a main tank, mixing roll, applicator roll and doctor blade to apply encapsulation composition 3 to the substrate 4 on. The mixing roll was set to 140°C. Position the doctor blade so that the distance from the doctor blade to the applicator roll is 0.45 mm. The size of the gap between the application roller and the substrate 4 is 0.2 mm.

[0094] To prepare the encapsulated article of Example 1, Encapsulation Composition 3 was heated to a temperature of 140°C until it was completely melted and in liquid form. The substrate 4 was then transferred to the applicator roller at a linear rate of 3.5 meters per minute (m / min) while being supported from below in such a way that the substrate 4 passed under the applicator roller as horizontally as possible. As the substrate 4 passed under the application rollers, the encapsulation composition 3 was ...

Embodiment 2

[0096] The encapsulated article of Example 2 was prepared in substantially the same manner as described in Example 1 above, except that after the encapsulation layer was formed on the substrate 4, while the encapsulation layer was still hot, 100 mm long x 40 mm wide x A 0.2 mm thick thin film solar array was placed on the encapsulation layer.

[0097] The size of the gap between the substrate and the application roller was then set to 0.4 mm and the substrate with the thin film solar array positioned on top of the encapsulation layer was passed under the application roller of the HARDO T150 application system and the encapsulation composition was 3 is applied on the thin film solar array to encapsulate the thin film solar array with the layer of encapsulating composition 3 . The resulting construction was passed through the system two additional times, during which time two additional layers of encapsulating composition 3 were applied to the construction. The gap between the ...

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Abstract

The invention discloses a method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition is substantially free of voids.

Description

technical field [0001] The present disclosure relates to encapsulating at least one component in an encapsulating composition. Background technique [0002] In general, one method that can be used to construct electronic devices includes packaging electronic components on a substrate. The electronic components can be encapsulated on the substrate by placing a preformed film on top of the electronic components and then placing the substrate with the electronic components and film in an oven. An oven can be used to heat the film to soften it. The softened film can be formed on the electronic component, and the film allowed to cool and solidify. After curing, the film can encapsulate electronic components on the substrate. When a pre-formed film to be heated is used for subsequent forming on the part to be packaged, the film must generally be self-supporting to allow handling of the film prior to heating. When a film of sufficient thickness to be self-supporting is used, in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/24
CPCB32B2457/12H01L31/048B32B37/24B32B2037/243B32B37/003Y02E10/50C08L23/12C08L23/0853C08L101/00H01L21/67126H01L31/0481H01L31/18
Inventor P·雷默斯V·K·科斯特勒T·F·考夫曼
Owner HB FULLER CO
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