Wafer holder and grinding machine

Abstract

The invention discloses a wafer holder and a grinding machine. The wafer holder comprises a supporting ring and a fixing ring, the supporting ring is provided with a first surface and a second surface which are opposite to each other, and the first surface of the supporting ring is used for being connected with a grinding head when a wafer is ground; the fixing ring is arranged on the second surface of the supporting ring, a chamfer is arranged on the inner circumferential wall of the fixing ring and arranged on the side, back to the supporting ring, of the fixing ring, a fixing position used for fixing the wafer is formed on the inner side of the fixing ring, and the surface of the fixing ring is used for making contact with a grinding pad when the wafer is ground. According to the wafer holder, the structure of the wafer holder is improved, the contact point of the wafer holder and the grinding pad is shifted towards the center of the wafer holder, the deformation point of the grinding pad is changed from the wafer edge to the position making contact with a wafer holder body, and the problem that the grinding rate of the wafer edge is increased due to increase of pressure is avoided.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a wafer holder and a grinding machine. Background technique [0002] With the emerging and gradual application of 5G, its advantages such as ultra-high speed, ultra-low latency, and ultra-high density have enabled the rapid development of emerging technologies such as the Internet of Things, artificial intelligence, and unmanned driving. This requires the production of 5G technology chips with high efficiency and low energy consumption. With the development of semiconductor chip manufacturing technology, the role and requirements of chemical mechanical planarization (CMP) for 200mm and above wafers (Wafer) in chip production are getting higher and higher. Chip devices are getting smaller and smaller, and the line width is getting narrower and narrower. The control accuracy of parameters such as surface topography and unevenness of the within wafer (WIW) is getting hig...

AI Technical Summary

Problems solved by technology

[0003] At present, during the grinding process of the grinding machine, the grinding rate of the edge of the wafer will be significantly higher than that of the middle area (such as figure 1 As shown), there will be an obvious height difference between the edge of the wafer and the center of the wafer, and the overall uniformity is low, so that the quality of the wafer after grinding cannot meet the actual demand

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