CMP equipment simulation test method and test system

Abstract

The invention discloses a CMP equipment simulation test method and system, and the method comprises the steps: initializing a hardware module, configuring the hardware information of the hardware module, the hardware information at least comprises channel information and an operation numerical value, and storing the hardware module and the hardware information in a simulation shared memory to guarantee the uniqueness of the information; starting simulation CMP equipment built by a hardware module, and acquiring an output value of an output point in the channel information; determining the operation condition of the simulation CMP equipment according to the output value, wherein the output value is stored in a simulation shared memory; and under the condition that the running condition of the CMP equipment is simulated to be normal, modifying at least one running numerical value into an abnormal value, and detecting the response condition of the monitoring alarm function and the fault recovery capability of the CMP equipment according to the new output value of the output point. The problem that traditional CMP simulation software does not have a test monitoring function is solved.

Description

technical field [0001] The invention relates to the field of CMP equipment manufacturing, in particular to a CMP equipment simulation test method and a test system. Background technique [0002] In the manufacture of integrated circuits and other electronic devices, multiple layers of conductive, semiconducting and dielectric materials may be deposited and removed from surfaces on semiconductor wafers. As layers of material are sequentially deposited and removed, the uppermost surface of the wafer becomes uneven. Since subsequent semiconductor processing (eg metallization) requires the wafer to have a flat surface, the wafer needs to be planarized. CMP (Chemical Mechanical Polishing, chemical mechanical polishing) technology is a commonly used semiconductor device polishing technology at present, and the CMP equipment produced based on this technology has extremely strong process and efficiency requirements. If CMP equipment meets the requirements of process and efficiency...

AI Technical Summary

Problems solved by technology

For this reason, the simulation test is a very important link in the software system testing work, while the traditional simulation test software can only simulate the operation process of the CMP equipment when the parameters such as flow rate and pressure are set normally. For unexpected abnormal situations during operation, the monitoring function can only be tested after the CMP hardware equipment is produced, which reduces work efficiency

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