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Packaged Stackable electronic power device and circuit arrangement for surface mount

A technology for power devices and packages, applied in the field of stackable electronic power devices and circuit devices, can solve the problems of high heat dissipation and complexity

Pending Publication Date: 2021-10-22
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the above solution works very well for devices with bridge connections, but is somewhat complex in the case of simpler circuits or when high power (and thus high heat dissipation) is required

Method used

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  • Packaged Stackable electronic power device and circuit arrangement for surface mount
  • Packaged Stackable electronic power device and circuit arrangement for surface mount
  • Packaged Stackable electronic power device and circuit arrangement for surface mount

Examples

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Embodiment Construction

[0043] In the following description, spatial indications such as "above", "under", "top", "bottom", "above", "below", "left side", "right side" etc. refer to the drawings and understood only in a relative sense.

[0044] Figure 1 to Figure 8 Power devices 1 are shown, such as for example MOSFETs of silicon carbide or silicon, but the following description applies to different types of devices, such as superjunction MOSFETs, IGBTs, etc., and power circuits including such devices, for example bridges (half-bridge or full bridge) configuration or circuits in an AC switching configuration, PFC (power factor correction) circuits and SMPS (switch mode power supply) devices.

[0045] The power device 1 includes an embedded die 6 ( Figure 7 and Figure 8 ) Encapsulation 2 of electrically insulating material such as resin. Die 6 has a first side 6A (in Figure 7 at the top) and the second side 6B (at the Figure 7 at the bottom of the ), contact pads are formed in a known manne...

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Abstract

The disclosure relates to a packaged stackable electronic power device and a circuit arrangement for surface mount. The power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

Description

technical field [0001] The present disclosure relates to a packaged stackable electronic power device for surface mounting and a circuit arrangement comprising a plurality of packaged electronic power devices stacked on top of each other. Background technique [0002] For example, devices such as silicon carbide devices or silicon devices can operate at high voltages (even up to 1700V) with rapidly switchable currents, or for example either in a bridge (half-bridge or full-bridge) configuration, or in an AC switching configuration MOSFET, super junction MOSFET, IGBT, etc., PFC (power factor correction) circuit, SMPS (switch mode power supply) device. [0003] For such electronic power devices, specific packages have been designed that enable high heat dissipation. These packages are typically formed by embedding the die integrating the electronic component(s) with a rigid insulator (e.g. resin) having a parallelepiped shape and a dissipative structure arranged between the d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/31
CPCH01L23/49541H01L23/49562H01L23/3114H01L23/3121H01L23/49548H01L23/49524H01L23/4334H01L23/3107H01L25/117H01L23/3735H05K1/0206H01L23/3677H05K3/0061H05K2201/066H01L2224/0603H01L2224/48247H01L23/49513H01L23/4952H01L23/49537H01L23/49568H01L23/49575H01L24/49H01L2924/181
Inventor C·G·斯特拉F·V·科波内F·萨拉莫内
Owner STMICROELECTRONICS SRL