A Microstrip-Microstrip Vertical Transition Structure Based on Cavity Coupling
A vertical transition, microstrip line technology, applied in waveguide-type devices, circuits, connecting devices, etc., can solve the problems of poor heat dissipation performance, low thickness of the common stratum, and inability to isolate crosstalk, etc., to achieve small circuit crosstalk and excellent high-frequency performance. , Excellent effect of high frequency transmission performance
Active Publication Date: 2022-05-13
BEIJING UNIV OF POSTS & TELECOMM
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Problems solved by technology
However, due to the low thickness of the common ground, this structure has poor heat dissipation performance and cannot isolate the crosstalk between the upper and lower circuits.
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[0028] In order to better understand the technical solution, the method of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0029] Such as Figure 4 As shown, the present invention provides a microstrip line-microstrip line vertical transition structure based on cavity coupling, which is composed of an upper dielectric substrate 1, a common ground plate 2 and a lower dielectric substrate 3, the upper dielectric substrate 1 and the lower dielectric substrate There are microstrip lines 4 on the substrate 3 respectively, and patches 5 are attached to the ends of the microstrip lines 4 respectively. The common ground plate 2 is provided with a metal cavity 6, and electromagnetic signals can be coupled to the upper and lower microstrip lines through the metal cavity on the common ground plate.
[0030] Since the quarter wavelength distance from the open circuit of the transmission line is equal to the short circuit ground, th...
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Abstract
The invention discloses a microstrip line-microstrip line vertical transition structure based on cavity coupling and its application. The structure is composed of an upper dielectric substrate, a common ground plane and a lower dielectric substrate. The upper dielectric substrate and the lower dielectric substrate There are microstrip lines on the top respectively, the ends of the microstrip lines are respectively pasted with patches, the length of the patch is a quarter of the transmission wavelength, the width of the patch is greater than the width of the microstrip line, and the common ground plate There is a metal cavity on the top, and the electromagnetic signal can be coupled to the upper and lower microstrip lines through the metal cavity on the common ground plane. The invention reduces the model insertion loss by adding patches, greatly improves the transmission bandwidth, and can be applied to three-dimensional high-speed microwave circuits.
Description
technical field [0001] The invention relates to the technical field of microwave circuits, in particular to a cavity-coupling-based microstrip-microstrip vertical transition structure and its application. Background technique [0002] With the rapid growth of the global communication rate and the demand for device miniaturization, the complexity of microwave integrated circuits continues to increase, and the rate continues to increase. Traditional two-dimensional single-plane microwave circuits cannot meet design requirements, and three-dimensional microwave integrated circuits (3DMIC, Three-dimensional microwave integrated circuit) are more and more widely used in microwave systems. [0003] In a three-dimensional microwave integrated circuit, the transition between the upper and lower layer signals is very important, and the transmission quality of the upper and lower layer signals affects the performance of the entire microwave circuit system. Therefore, how to realize t...
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IPC IPC(8): H01P5/08H01P5/107
CPCH01P5/08H01P5/107
Inventor 陈远祥孙尚斌付佳杨雷静林尚静余建国
Owner BEIJING UNIV OF POSTS & TELECOMM