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High-frequency module and communication device

A technology for high-frequency modules and mounting substrates, which can be used in electrical components, transmission systems, electrical solid-state devices, etc., and can solve problems such as difficulties in miniaturizing high-frequency modules.

Pending Publication Date: 2021-10-29
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In mobile communication devices such as mobile phones, especially with the development of multi-band, the number of circuit elements constituting the high-frequency front-end circuit increases, making it difficult to miniaturize high-frequency modules

Method used

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  • High-frequency module and communication device
  • High-frequency module and communication device
  • High-frequency module and communication device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0025] refer to Figure 1 ~ Figure 3 Embodiments will be described.

[0026] [1 Circuit configuration of high-frequency module 1 and communication device 5]

[0027] First, refer to figure 1 The circuit configurations of the high-frequency module 1 and the communication device 5 according to the present embodiment will be specifically described.

[0028] figure 1 It is a circuit configuration diagram of the high-frequency module 1 and the communication device 5 according to the embodiment. Such as figure 1 As shown, the communication device 5 includes a high-frequency module 1 , an antenna element 2 , an RF (radio frequency) signal processing circuit (RFIC) 3 , and a baseband signal processing circuit (BBIC) 4 .

[0029] The high-frequency module 1 transmits high-frequency signals between the antenna element 2 and the RFIC 3 . The high-frequency module 1 is, for example, LTE (LongTerm Evolution: Long Term Evolution), Wi-Fi (registered trademark), Bluetooth (registered tr...

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Abstract

This high-frequency module (1) is provided with a mounting board (90) having mutually opposite primary surfaces (90a and 90b), a duplexer (21) which has a transmission filter (21T) connected to a node (N1) and a receiving filter (21R) connected to the node (N1), wherein the transmission filter (21T) is mounted on the primary surface (90a), the receiving filter (21R) is mounted on the primary surface (90b), and, when the mounting board (90) is viewed in planar view, the transmission filter (21T) and the receiving filter (21R) at least partially overlap.

Description

technical field [0001] The invention relates to a high-frequency module and a communication device equipped with the high-frequency module. Background technique [0002] In mobile communication devices such as mobile phones, the number of circuit elements constituting the high-frequency front-end circuit increases especially with the development of multi-band, making it difficult to miniaturize high-frequency modules. [0003] Patent Document 1 discloses a semiconductor module in which miniaturization is achieved by a wiring substrate that can be mounted on both sides. Specifically, a transmission circuit composed of a power amplifier (power amplifier) ​​and a transmission filter, and a low noise amplifier (low noise amplifier) ​​are connected between the antenna switch and a high-frequency IC (Integrated Circuit: integrated circuit) circuit unit. A receiving circuit composed of a receiving filter. [0004] prior art literature [0005] patent documents [0006] Patent D...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H04B1/38
CPCH04B1/38H01L23/12H04B1/08H04B1/1018H04B1/18H04B1/1615H04B1/40H04B1/0458
Inventor 山口幸哉
Owner MURATA MFG CO LTD