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Semiconductor structure and manufacturing method thereof

A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, transistors, etc., can solve problems such as capacitance signal errors, and achieve the effect of solving threshold voltage instability and avoiding floating body effect.

Active Publication Date: 2021-11-09
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Embodiments of the present invention provide a semiconductor structure and its manufacturing method to solve the problem of capacitance signal errors in the related art

Method used

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  • Semiconductor structure and manufacturing method thereof
  • Semiconductor structure and manufacturing method thereof
  • Semiconductor structure and manufacturing method thereof

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Embodiment Construction

[0076]Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0077] Such as figure 1 and figure 2 as shown, figure 1 Shown is a schematic diagram of a semiconductor structure of an embodiment of the present invention. The semiconductor structure of the embodiment of the present invention includes: a substrate 100, an active column structure 110, a gate dielectric layer, a word line 120a, and a body line 120b. The active column structure 110 is disposed on the substrate 100, including...

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Abstract

The embodiment of the invention discloses a semiconductor structure and a manufacturing method thereof. The semiconductor structure comprises a substrate, an active column structure, a word line, a gate dielectric layer and a body line, and the active column structure is arranged on the substrate; the word line is arranged at the first side of the active column structure and extends in the first direction, and the gate dielectric layer is arranged between the word line and a channel layer of the active column structure; and the body line is arranged on the second side of the active column structure and extends in the first direction, and the body line is in direct contact with the channel layer; wherein the first side and the second side are oppositely arranged.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor structure and a manufacturing method thereof. Background technique [0002] Each storage unit of a dynamic random access memory (DRAM) includes a storage capacitor and a transistor, and the data writing or reading of the storage unit is controlled by the transistor. However, the vertical transistor of the memory in the related art has the problem of unstable threshold voltage of the array, which causes the problem of wrong capacitance signal, resulting in a low yield. Contents of the invention [0003] Embodiments of the present invention provide a semiconductor structure and a manufacturing method thereof, so as to solve the problem of capacitance signal error in the related art. [0004] The semiconductor structure of the embodiment of the present invention includes: [0005] Substrate; [0006] an active pillar structure dispose...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/108H01L21/8242H10B12/00
CPCH10B12/30H10B12/05H10B12/488H10B12/482
Inventor 陈荣华
Owner CHANGXIN MEMORY TECH INC