3D printing device and printing method for embedded circuit products

Abstract

The invention belongs to the technical field of 3D printing, and discloses a 3D printing device for embedded circuit products. The 3D printing device comprises a rack, a printing platform, a first printing mechanism, a second printing mechanism and a milling module, the rack is provided with an X-axis guide rail, a Y-axis guide rail, a Z-axis guide rail, a first driving mechanism, a second driving mechanism, a third driving mechanism and a fourth driving mechanism; the first driving mechanism is used for driving the first printing mechanism and the second printing mechanism to slide along the X-axis guide rail; the second driving mechanism is used for driving the X-axis guide rail to slide along the Y-axis guide rail; the third driving mechanism is used for driving the printing platform to ascend and descend along the Z-axis guide rail; and the fourth driving mechanism is used for driving the milling module to slide along the Y-axis guide rail. The printing method of the embedded circuit products can be used for printing combination of different materials, the combination effect is good, and the conductive reliability is high.

Description

technical field [0001] The invention relates to the technical field of 3D printing, in particular to a 3D printing device and a printing method for embedded circuit products. Background technique [0002] As a representative of 3D printing technology, Fused Deposition Modeling (Fused Deposition Modeling, FDM) is a process of forming a 3D solid model by superimposing and stacking molten filaments. It mainly extrudes linear filaments through high-temperature nozzles, and then melts them Layers of material are built up to create three-dimensional objects. [0003] For products printed by FDM, the connection between layers is only through the bonding of molten materials. Whether the bonding force between the materials of each layer is balanced directly affects the overall strength of the product. When printing layers of different materials are piled up, due to the different materials between layers, the melting temperature is different and the shrinkage rate is inconsistent. O...

AI Technical Summary

Problems solved by technology

When printing layers of different materials are piled up, due to the different materials between layers, the melting temperature is different and the shrinkage rate is inconsistent. Integral, or partial delamination is particularly prone to occur, resulting in low overall strength of the product

Therefore, at present, FDM generally only prints products or parts of a single material

[0004] When the product composition contains different materials, such as embedded circuits in the product, take the production of wearable electronic helmets by FDM as an example. At present, the helmet body is usually printed separately by FDM, and then the parts are assembled with electronic components, or in The installation position is reserved when printing the helmet body, and electronic components are embedded in the installation position later. The production process of wearable electronic helmet products produced by these two methods is cumbersome, and the electronic components inside are easily affected by the external environment, and are prone to short circuits and other situations; There are also processing flow channels set up when printing the helmet body, and circuit conduction is realized by injecting conductive paste into the processing flow channel. Processing the cross-sectional area of ​​the flow channel will greatly increase the cost of the conductive paste

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