Check patentability & draft patents in minutes with Patsnap Eureka AI!

Chip testing process for improving production efficiency

A technology for chip testing and production efficiency, applied in electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problems of low detection efficiency, inability to identify chips, and long occupation time of the testing machine, so as to facilitate identification and improve the first test. efficiency, and the effect of improving the efficiency of the first test

Pending Publication Date: 2021-11-16
安徽大衍半导体科技有限公司
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The Hall effect tester is used to measure important parameters such as carrier concentration, mobility, resistivity, and Hall coefficient of semiconductor materials, and these parameters must be controlled in advance to understand the electrical characteristics of semiconductor materials, so it is necessary to understand and research An essential tool for the electrical characteristics of semiconductor devices and semiconductor materials; the instrument is a Hall effect instrument with stable performance, powerful functions, and high cost performance. It has a wide range of users and popularity in domestic universities, research institutes, and the semiconductor industry. Portable, mainly used to measure important characteristic parameters of electronic materials, such as carrier concentration, mobility, resistivity, Hall coefficient, etc., thin film or solid material can be used, and its principle is mainly based on the Vanderbilt law; a lifting The chip test process of production efficiency is based on the improvement of Hall effect tester technology to existing chip test process in CN107728036A; During the Hall detection process, it is possible to quickly identify such poorly bonded chips without requiring a long period of power-on to identify such chips. The traditional identification method is Powering on all the chips for a certain period of time cannot quickly identify chips with poor internal bonding, resulting in low detection efficiency and a long time for the detection machine

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip testing process for improving production efficiency
  • Chip testing process for improving production efficiency

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Such as figure 1 As shown, a chip testing process for improving production efficiency described in this embodiment includes the following steps:

[0023] Step 1 Install the chip, install the chip to be tested on the installation platform, connect the pins of the chip to the installation platform, and connect the switch control matrix to the chip pins on the installation platform;

[0024] Step 2 Connect the current, DC power supply and switch control matrix connection, and the console controls the DC power supply to provide a constant current for the chip;

[0025] Step 3: Adjust the magnetic field, control the magnetic field controller by the console, control the change of the magnetic field around the installation platform through the magnetic field controller, and prompt the chip to generate Hall voltage; control the magnetic field controller through the console, the permanent magnet in the magnetic field controller and the installation The relative movement of the ...

Embodiment 2

[0032] This embodiment is the detection data before the improvement of Embodiment 1; including:

[0033] The current in step 2 and the magnetic field adjustment in step 3 are carried out synchronously, and both the current in step 2 and the magnetic field adjustment in step 3 in the detection process of the SDC117 product take 440 ms, and the test efficiency is equal to that of the first test efficiency after the improvement of embodiment 1. 72.7%, leading to an increase in the occupancy rate of the machine and a decrease in detection efficiency.

Embodiment 3

[0035] This embodiment is the detection data of SDC1177 through the detection process in embodiment 1; including:

[0036] The step 2 turning on the current and the step 3 magnetic field adjustment are carried out synchronously, and the step 2 turning on the current and the step 3 magnetic field adjustment in the detection process of the SDC1177 product both take 1000ms.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a chip testing process for improving production efficiency. The chip testing process comprises the following steps: 1, installing a chip; 2, switching on current; 3, adjusting a magnetic field; 4, collecting electric signals; 5, electric signal processing; 6, comparing data; and 7, feeding back data. The step 2 of current connection and the step 3 of magnetic field adjustment are carried out synchronously, the time of current connection in the step 2 of current connection and the time of magnetic field adjustment in the step 3 of magnetic field adjustment in the detection process of the SDC117 product are both shortened to 320 ms, the efficiency of first detection is improved by 137.5%, and chips with poor internal bonding are recognized quickly. In the detection process, the original detection time of 440ms is shortened to 320ms, so that the first detection efficiency is improved by 137.5% compared with the original detection time, chips with poor internal bonding can be conveniently and quickly identified, the first detection efficiency of the chips is improved, the occupation efficiency of a Hall detection machine is reduced, and the first detection efficiency is improved; and meanwhile, defective chips which are not detected can still be identified in the subsequent detection after the first detection.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a chip testing process for improving production efficiency. Background technique [0002] The Hall effect tester is used to measure important parameters such as carrier concentration, mobility, resistivity, and Hall coefficient of semiconductor materials, and these parameters must be controlled in advance to understand the electrical characteristics of semiconductor materials, so it is necessary to understand and research An essential tool for the electrical characteristics of semiconductor devices and semiconductor materials; the instrument is a Hall effect instrument with stable performance, powerful functions, and high cost performance. It has a wide range of users and popularity in domestic universities, research institutes, and the semiconductor industry. Portable, mainly used to measure important characteristic parameters of electronic materials, such as ca...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R31/28G01R19/165
CPCG01R31/2851G01R31/2853G01R19/16576
Inventor 徐一宝
Owner 安徽大衍半导体科技有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More