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A kind of spherical silver powder with controllable particle size distribution and preparation method and application thereof

A kind of spherical, silver powder technology, used in cable/conductor manufacturing, semiconductor devices, electrical components, etc., can solve the problems of complex steps, poor mixing effect, difficult to mix evenly, etc., to achieve short production cycle, uniform dispersion, good repeatability Effect

Active Publication Date: 2022-08-02
山东建邦胶体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to reduce the gap between silver powder particles and increase the tap density of silver powder, it is usually necessary to synthesize silver powders with different particle sizes separately, and then mix them by physical mixing, so the steps are complicated, and the mixing effect is poor, and it is difficult to mix. uniform

Method used

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  • A kind of spherical silver powder with controllable particle size distribution and preparation method and application thereof
  • A kind of spherical silver powder with controllable particle size distribution and preparation method and application thereof
  • A kind of spherical silver powder with controllable particle size distribution and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Example 1 Class Spherical Silver Powder 1#

[0056] 1) Dosing

[0057] Silver nitrate solution A: Dissolve 500 grams of silver nitrate in 2750 grams of deionized water, stir and dissolve, and add 25 grams of concentrated nitric acid to prepare silver nitrate solution A. Among them, the concentration of silver nitrate solution is about 1.0mol / L, and the amount of concentrated nitric acid is 0.05 times the mass of silver nitrate.

[0058] Dispersant solution B: Dispersing agent solution B was prepared by dissolving 250 grams of dispersant K30 in 3300 grams of deionized water with stirring. The amount of dispersant is 0.5 times the mass of silver nitrate in solution A; the amount of deionized water in solution B is 1.2 times the amount of deionized water in solution A.

[0059] Ascorbic acid solution C: Dissolve 360 ​​grams of ascorbic acid in 2750 grams of deionized water with stirring to dissolve to prepare ascorbic acid solution C. The amount of ascorbic acid in solu...

Embodiment 2

[0068] Example 2 Class Spherical Silver Powder 2#

[0069] 1) Dosing

[0070] Silver nitrate solution A: Dissolve 750 grams of silver nitrate in 2750 grams of deionized water, stir and dissolve, and add 60 grams of concentrated nitric acid to prepare silver nitrate solution A. Among them, the concentration of silver nitrate solution is about 1.5mol / L, and the amount of concentrated nitric acid is 0.08 times the mass of silver nitrate.

[0071] Dispersant solution B: Disperse solution B was prepared by dissolving 300 grams of dispersant K30 in 3850 grams of deionized water with stirring. The amount of dispersant is 0.4 times the mass of silver nitrate in solution A; the amount of deionized water in solution B is 1.4 times the amount of deionized water in solution A.

[0072] Ascorbic acid solution C: Dissolve 460 grams of ascorbic acid in 2750 grams of deionized water with stirring to dissolve to prepare ascorbic acid solution C. The amount of ascorbic acid in solution C is ...

Embodiment 3

[0081] Example 3 spherical silver powder 3#

[0082] 1) Dosing

[0083] Silver nitrate solution A: Dissolve 750 grams of silver nitrate in 2750 grams of deionized water, stir and dissolve, and add 60 grams of concentrated nitric acid to prepare silver nitrate solution A. Among them, the concentration of silver nitrate solution is about 1.5mol / L, and the amount of concentrated nitric acid is 0.08 times the mass of silver nitrate.

[0084] Dispersant solution B: Dispersing agent solution B was prepared by dissolving 265 grams of dispersant K30 in 3300 grams of deionized water with stirring. The amount of dispersant is about 0.35 times the mass of silver nitrate in solution A; the amount of deionized water in solution B is 1.2 times the amount of deionized water in solution A.

[0085] Ascorbic acid solution C: Dissolve 425 grams of ascorbic acid in 2750 grams of deionized water with stirring to dissolve to prepare ascorbic acid solution C. The amount of ascorbic acid in solut...

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Abstract

The application discloses a spherical silver powder with a controllable particle size distribution, a preparation method and application thereof, and belongs to the technical field of silver powder preparation. The silver powder includes a first silver powder, a second silver powder and a third silver powder, and the particle size ranges of the first silver powder, the second silver powder and the third silver powder are respectively 2.7-5 μm, 0.3-0.7 μm and 0.8-2.5 μm, so The mass fraction of the first silver powder is 5% to 20%, and the mass fraction of the second silver powder is 5% to 25%. This kind of spherical silver powder has a wide range of particle size distribution, is composed of particles of different particle sizes, and has micron, submicron and nano-scale silver powder at the same time, with high tap density, large specific surface area and uniform dispersion. It has a broad application prospect in the field of electronic pastes such as silver paste for solar cells and / or electrode silver paste for electronic components.

Description

technical field [0001] The application relates to a quasi-spherical silver powder with controllable particle size distribution, a preparation method and application thereof, and belongs to the technical field of silver powder preparation. Background technique [0002] Silver powder has excellent electrical and thermal conductivity, and is widely used in thick film conductive paste, high and low temperature conductive paste, electromagnetic shielding and other electronic paste fields. As a conductive filler, silver powder is an important part of electronic paste and a key material that determines the performance of the paste. Therefore, it is currently the most widely used and the largest amount of precious metal powder materials. [0003] In order to meet the ever-changing functional requirements of electronic and microelectronic devices, newer and higher performance requirements are also placed on electronic pastes and their silver powders. As a precious metal powder mater...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/02H01B13/00H01L31/0224
CPCH01B1/02H01B13/00H01L31/022425Y02E10/50
Inventor 马跃跃陈波许文艳王艳云陈朋韩世生彭鲁川
Owner 山东建邦胶体材料有限公司
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