Bulk acoustic wave resonator, packaging method thereof and electronic equipment
A technology of bulk acoustic wave resonators and packaging methods, which is applied to electrical components, impedance networks, etc., can solve problems such as high production costs, complicated process flow, and long production cycles of bulk acoustic wave resonators, and achieve reduced production cycles and production costs. The effect of simplifying the process
Pending Publication Date: 2021-11-16
SUZHOU HUNTERSUN ELECTRONICS CO LTD
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Problems solved by technology
However, the process flow of this packaging technology is relatively complicated, resulting in long production cycle and high production cost of bulk acoustic wave resonator
Method used
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Embodiment Construction
[0048] As mentioned in the background art, wafer-level packaging technology is mostly used to bond a second substrate on a first substrate with a bulk acoustic wave resonator, and then bond it integrally on a packaging substrate for packaging. Such as figure 1 As shown, a resonant structure is first formed on the first substrate 10, and the resonant structure includes a piezoelectric layer 110, a first electrode 111 and a second electrode 112, and then, as figure 2 As shown, the first substrate 10 is bonded to the second substrate 12, and then a first through hole and a second through hole are formed through the second substrate 12, and a first conductive plug is formed in the first through hole. 121, forming a second conductive plug 122 in the second through hole, the first conductive plug 121 is electrically connected to the first electrode 111, the second conductive plug 122 is electrically connected to the second electrode 112, and then, as image 3 As shown, it is elec...
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The invention provides a bulk acoustic wave resonator, a packaging method thereof and electronic equipment, and the method comprises the steps: providing a first substrate, one side of the first substrate is provided with a resonant structure, and the resonant structure comprises a first electrode, a second electrode, and a piezoelectric layer located between the first electrode and the second electrode; forming a first conductive part, a second conductive part and a first packaging part on one side of the first substrate, the first conductive part being electrically connected with the first electrode, and the second conductive part being electrically connected with the second electrode; providing a packaging substrate, wherein one side of the packaging substrate is provided with a first connecting end, a second connecting end and a second packaging piece; attaching the first substrate to the packaging substrate, the first conductive part being electrically connected with the first connecting end, the second conductive part being electrically connected with the second connecting end, and the first packaging part and the second packaging part being fixedly connected to form the annular packaging retaining wall, so that the condition that the first substrate is packaged by the second substrate and then is electrically connected with the packaging substrate is not needed; the process flow can be simplified, and the production cycle and cost can be reduced.
Description
technical field [0001] Embodiments of the present invention relate to the technical field of semiconductors, and in particular to a bulk acoustic wave resonator, a packaging method thereof, and electronic equipment. Background technique [0002] Film Bulk Acoustic Resonator (FBAR), also known as Bulk Acoustic Resonator or BAW, is widely used in wireless communication due to its small size, high operating frequency, low power consumption and high quality factor. Important fields such as radio frequency, biology and medicine. [0003] At present, most of them use wafer level packaging (Wafer Level Package, referred to as WLP) technology, bonding the second substrate on the first substrate with bulk acoustic wave resonator, and then bonding it as a whole on the packaging substrate for packaging. . However, the process flow of this packaging technology is relatively complicated, resulting in a long production cycle and high production cost of the bulk acoustic wave resonator. ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H03H9/02H03H9/05H03H3/02
CPCH03H9/02015H03H9/02062H03H9/0504H03H3/02H03H2003/023
Inventor 王矿伟杨清华唐兆云赖志国吴明王家友钱盈
Owner SUZHOU HUNTERSUN ELECTRONICS CO LTD