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Ultrathin coreless three-layer circuit board and preparation method thereof

A circuit board, three-layer board technology, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, circuit devices, etc., can solve the problems of insufficient wire processing thin plate ability, material waste, etc., to reduce production and process costs, reduce materials Waste, the effect of improving manufacturing efficiency

Pending Publication Date: 2021-11-16
惠州市志金电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, although the methods in the prior art avoid the risk of insufficient wire body processing capacity to a certain extent, there is also the problem of material waste

Method used

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  • Ultrathin coreless three-layer circuit board and preparation method thereof
  • Ultrathin coreless three-layer circuit board and preparation method thereof
  • Ultrathin coreless three-layer circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A kind of ultra-thin coreless three-layer circuit board, see Figure 1-7 , including the composite board, the composite board includes two three-layer boards, it can be understood that after the composite board is manufactured, the composite board can be disassembled into two three-layer boards, that is, two three-layer circuit boards are formed.

[0046] The composite board includes two conductor layers 1 that are attached to each other, and the first PP layer 2 is wrapped around the two conductor layers 1, that is, under the wrapping of the first PP layer 2, the two conductor layers 1 are fixed together to form a As a whole, other components can be added on the outside of the two conductor layers 1 to form a two-part symmetrical circuit board.

[0047] In practical applications, the first PP layer 2 can be a semi-cured PP layer, and the semi-cured PP layer can be placed on the outside of the two conductor layers 1 at the beginning, and then under high temperature pres...

Embodiment 2

[0065] A kind of ultra-thin coreless three-layer circuit board, differs from Embodiment 1 in that, see Figure 8 A solder resist layer 6 is provided on the outside of the second copper foil layer 5, and the solder resist layer 6 may be a solder resist ink layer.

[0066] In practical application, when printing the solder resist layer 6, it is necessary to leak out the solder pads needed by the packaging factory and the assembly factory, and a protective layer 7 is provided on the outside of the second copper foil layer 5 where the solder resist layer 6 is not provided. , the protection layer 7 can be one of nickel-gold layer, nickel-palladium-gold layer, nickel-silver-gold layer, nickel-silver layer, OSP layer or tin layer.

[0067] This embodiment also provides a preparation process for an ultra-thin coreless three-layer circuit board. The difference from Embodiment 1 is that after the two three-layer boards are obtained, it also includes:

[0068] Perforate the second coppe...

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Abstract

The invention provides an ultrathin coreless three-layer circuit board and a preparation method thereof. The circuit board comprises a composition board which comprises two three-layer boards. The composition board comprises two conductor layers which are attached to each other, the peripheries of the two conductor layers are wrapped with first PP layers, and first copper foil layers are pressed on the outer sides, parallel to the conductor layers, of the first PP layers; a circuit is etched on the first copper foil layer, a second PP layer and a second copper foil layer are sequentially arranged on the side, away from the conductor layer, of the first copper foil layer, and the second PP layer is connected with the first PP layer; the three-layer board is obtained by cutting the first PP layers at the two ends of the composition board. According to the invention, the ultrathin circuit board with any number of layers can be realized, the manufacturing efficiency is improved by 100%, the true coreless board is realized, the material waste is reduced, and the manufacturing and flow cost is further reduced.

Description

technical field [0001] The invention relates to circuit board technology, in particular to an ultra-thin coreless three-layer circuit board and a preparation method thereof. Background technique [0002] The coreless arbitrary layer circuit board naturally has the advantages of ultra-thin and 100% efficiency improvement, which are difficult to obtain by traditional multilayer circuit boards. [0003] In the prior art, the conventional method for preparing a coreless arbitrary layer circuit board needs to be established on a peelable CCL (Dummy copper clad laminate, only used as a carrier board), and then separated after the lamination of the outermost layer is completed. Board, get 2 identical circuit boards of any layer and 1 CCL. [0004] However, although the method in the prior art avoids the risk of insufficient wire body processing capacity to a certain extent, it also has the problem of material waste. Contents of the invention [0005] Embodiments of the present ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0213H05K1/0204H05K3/46H05K3/4644
Inventor 康孝恒蔡克林唐波杨飞李瑞许凯蒋乐元
Owner 惠州市志金电子科技有限公司
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