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Electronic component

A technology for electronic components and electrodes, applied to electrical components, parts of transformers/inductors, circuits, etc., can solve problems such as high contact resistance at joints and insufficient joint strength

Pending Publication Date: 2021-11-19
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the terminal electrode of Patent Document 2, there is a technical problem that the joint strength with the lead-out electrode cannot be ensured sufficiently, and the contact resistance of the joint portion becomes high.

Method used

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Embodiment

[0112] Hereinafter, the present invention will be further described based on detailed examples, but the present invention is not limited to these examples.

[0113] Example

[0114] In the example, making figure 1 The inductor sample shown. Specifically, an element main body having a planned electrode portion is produced by the method described in the embodiment, and a resin electrode layer having a thickness of 10 to 20 μm is formed on the planned electrode portion. When forming the resin electrode layer, a paste for resin electrodes containing flat first particles (Ag microparticles) and second particles (Ag nanoparticles) is used, and heat treatment is performed under the conditions described in the embodiment. Then, with respect to the obtained inductor sample, the interface between the lead-out electrode part and the terminal electrode was analyzed by STEM-EPMA (line analysis). As a result, in the example, with Figure 6A Similarly to the graph of , it was confirmed...

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Abstract

An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.

Description

technical field [0001] The present invention relates to an electronic component having terminal electrodes. Background technique [0002] As disclosed in Patent Document 1, there is known an electronic component in which terminal electrodes (also referred to as external electrodes) are formed on the outer surface of an element body. In this electronic component, the terminal electrodes are connected to internal electrodes provided in the element body or lead electrodes such as lead wires. [0003] Such a terminal electrode can be obtained by, for example, as shown in Patent Document 1, coating the outer surface of the element body with a fired paste containing metal powder and glass components, and applying the paste at a temperature of about 700°C or higher. The part where the paste is applied is fired. However, when the terminal electrode is formed by firing at a high temperature as described above, defects such as cracks may occur in the element body due to the influenc...

Claims

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Application Information

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IPC IPC(8): H01F27/29H01F17/04
CPCH01F27/292H01F17/04H01F27/29H01F41/06H01F27/2823
Inventor 乾京介森田诚工藤孝洁安保敏之殿山恭平三浦冬树须贝正则阿部荣悦外海透小柳佑市
Owner TDK CORPARATION