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Selectively packaged SiP module with optical sensor and preparation method of selectively packaged SiP module

An optical sensor and selective technology, applied in optical device exploration, semiconductor/solid-state device manufacturing, electric solid-state device, etc., can solve problems such as complex process flow, and achieve the effect of broad application market and development prospects

Pending Publication Date: 2021-11-19
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Selective packaging in the prior art has the disadvantages that the process flow is relatively complicated, and special molds or packaging designs are required

Method used

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  • Selectively packaged SiP module with optical sensor and preparation method of selectively packaged SiP module
  • Selectively packaged SiP module with optical sensor and preparation method of selectively packaged SiP module
  • Selectively packaged SiP module with optical sensor and preparation method of selectively packaged SiP module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] (1) The optical sensor 5, the chip 2 and the passive components 3 are mounted on the substrate 1 by using the SMT placement-chip-bonding process, such as figure 2 shown;

[0034] (2) Mounting of the retaining wall 4 , mount the retaining wall 4 on the four sides and the top surface of the non-plastic-encapsulated area where the optical sensor 5 is installed. If the retaining wall 4 is an integral structure, then install it directly; if it is a separate structure, then install the retaining wall 4 on four sides first, then install the retaining wall 4 on the top, and then carry out plastic sealing after curing, as image 3 shown;

[0035] (3) Carry out plastic sealing, including two plastic sealing methods, respectively, the height of the plastic sealing material is slightly higher than the top retaining wall 4 (such as Figure 4 shown) or the height of the molding compound is equal to the height of the retaining wall 4 (such as Figure 5 shown);

[0036] (4) Window...

Embodiment 2

[0039] (1) Install the chip 2 and the passive components 3 on the substrate 1 by using the SMT placement-chip-bonding process, such as Figure 7 shown;

[0040] (2) Mounting of the retaining wall 4 , mount the retaining wall 4 on the four sides and the top surface of the non-plastic-encapsulated area where the optical sensor 5 is to be installed. If the retaining wall 4 is an integral structure, then install it directly; if it is a separate structure, then install the retaining wall 4 on four sides first, then install the retaining wall 4 on the top, and then carry out plastic sealing after curing, as Figure 8 shown;

[0041] (3) Carry out plastic sealing, including two plastic sealing methods, respectively, the height of the plastic sealing material is slightly higher than the top retaining wall 4 (such as Figure 9 shown) or the height of the molding compound is equal to the height of the retaining wall 4 (such as Figure 10 shown);

[0042] (4) Window opening can be do...

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Abstract

The invention discloses a selectively-packaged SiP module with an optical sensor and a preparation method of the selectively-packaged SiP module. According to the selective packaging scheme, a retaining wall can realize selective plastic packaging at any position of the module, and a customized packaging scheme with a specific function module is provided; in addition, according to the module preparation scheme that an optical sensor is installed before the retaining wall is prepared, the packaging overall size can be minimum, the height of the retaining wall can be adjusted at will to be matched with the packaging overall thickness, the packaged optical sensor cannot be affected, and miniaturization of devices can be achieved easily. The selectively packaged SiP module and the preparation method thereofcan be applied to emerging fields such as smart phones, artificial intelligence, automatic driving, 5G networks, the Internet of Things, wearable electronic equipment and remote control and telemetering optical sensors, meet the development requirement for miniaturization of current electronic products, and have wide application market and development prospects in the field of microelectronics.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a selective packaging SiP module with an optical sensor and a preparation method thereof. Background technique [0002] Optical sensors are used in various electronic devices such as cameras, vehicles, machines, wearables, etc. to detect the presence and / or distance of nearby objects from the device. An optical sensor usually includes a light emitting device, a light receiving sensor, and a processing chip that handles light emission and reception. Typically at the light emission and reception sites are transparent or light diffractive layers for receiving, emitting and / or diffracting light. There is no need for plastic packaging for the optical sensor (already packaged), it can be exposed directly. With the continuous development of semiconductor technology, SiP is an inevitable trend in the development of IC packaging. Selective encapsulation in the prior art...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L23/31H01L25/16G01V8/10
CPCH01L21/56H01L23/3157H01L23/3114H01L23/3121H01L25/167G01V8/10
Inventor 卢红亮缪小勇朱立远
Owner FUDAN UNIV
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