Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Chip packaging machine and method of use

A technology of chip packaging and stacking machine, which is applied in the direction of conveyor objects, transportation and packaging, electrical components, etc., and can solve the problems of low efficiency of manual operation

Active Publication Date: 2022-04-29
江苏美斯其新材料科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of low manual operation efficiency in the prior art, and propose a chip packaging machine and its use method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip packaging machine and method of use
  • Chip packaging machine and method of use
  • Chip packaging machine and method of use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Example 1: Reference Figure 1-13 A chip arranging machine for chip packaging comprises a supporting seat 1, a fixing plate 6, a placing seat 7, and a third motor 8 fixedly connected to the placing seat 7; A third screw 801 fixedly connected to the output end of the third motor 8; The clamp 13 is screwed on the third screw 801; An adjusting plate 14 detachably connected to the holder 13; The l-shaped adjusting lever 10 is slidably connected to the fixed plate 6; A vacuum chuck 17 detachably connected to the L-shaped adjusting rod 10; The fixing rod 11 is fixedly connected to the L-shaped adjusting rod 10; A roller 12 rotatably connected to the fixing rod 11; The adjusting plate 14 is slidably connected to the fixed plate 6, which is provided with a first adjusting groove 9, and the adjusting plate 14 is provided with a plurality of second adjusting grooves 15, and the second adjusting grooves 15 on both sides of the adjusting plate 14 are of inclined design, and the two fixi...

Embodiment 2

[0051] Example 2: Reference Figure 1-13 A chip arranging machine for chip packaging comprises a supporting seat 1, a fixing plate 6, a placing seat 7, and a third motor 8 fixedly connected to the placing seat 7; A third screw 801 fixedly connected to the output end of the third motor 8; The clamp 13 is screwed on the third screw 801; An adjusting plate 14 detachably connected to the holder 13; The l-shaped adjusting lever 10 is slidably connected to the fixed plate 6; A vacuum chuck 17 detachably connected to the L-shaped adjusting rod 10; The fixing rod 11 is fixedly connected to the L-shaped adjusting rod 10; A roller 12 rotatably connected to the fixing rod 11; The adjusting plate 14 is slidably connected to the fixed plate 6, which is provided with a first adjusting groove 9, and the adjusting plate 14 is provided with a plurality of second adjusting grooves 15, and the second adjusting grooves 15 on both sides of the adjusting plate 14 are of inclined design, and the two fixi...

Embodiment 3

[0060] Example 3: Reference Figure 1 、 Figure 3 and Figure 4 A chip arranging machine for chip packaging comprises a supporting seat 1, a fixing plate 6, a placing seat 7, and a third motor 8 fixedly connected to the placing seat 7; A third screw 801 fixedly connected to the output end of the third motor 8; The clamp 13 is screwed on the third screw 801; An adjusting plate 14 detachably connected to the holder 13; The l-shaped adjusting lever 10 is slidably connected to the fixed plate 6; A vacuum chuck 17 detachably connected to the L-shaped adjusting rod 10; The fixing rod 11 is fixedly connected to the L-shaped adjusting rod 10; A roller 12 rotatably connected to the fixing rod 11; The adjusting plate 14 is slidably connected to the fixed plate 6, which is provided with a first adjusting groove 9, and the adjusting plate 14 is provided with a plurality of second adjusting grooves 15, and the second adjusting grooves 15 on both sides of the adjusting plate 14 are of inclined des...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a chip arrangement machine for chip packaging and a use method thereof, belonging to the technical field of chip packaging. A chip packaging machine, including a support base, a fixed plate and a placement base, also includes: a third motor, fixedly connected to the placement base; a third screw rod, fixedly connected to the output end of the third motor; a clip base, Threaded connection on the third screw rod; adjusting plate, detachably connected to the clamp seat; L-shaped adjusting rod, slidingly connected to the fixed plate; vacuum suction cup, detachably connected to the L-shaped adjusting rod; fixed rod, fixedly connected On the L-shaped adjustment rod; the roller is connected to the fixed rod in rotation; wherein, the adjustment plate is slidably connected to the fixed plate, and the fixed plate is provided with a first adjustment groove; the present invention is easy to operate and reduces the labor intensity of the operator. At the same time, it speeds up the placement of chips, improves the efficiency and output of chip packaging, greatly improves the income of enterprises, and reduces the probability of chip damage.

Description

Technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip arranger for chip packaging and a use method thereof. technical background [0002] Chip packaging is the process of assembling integrated circuits into the final products of chips. Simply put, it is to put the produced bare chips of integrated circuits on a supporting substrate, lead out the pins, and then fix and package them into a whole. [0003] From chip production to final molding, in order to improve the efficiency, various companies work together. Some companies are only responsible for chip production, while others are only responsible for chip packaging. Therefore, in this process, the chip can be moved from the chip manufacturer to the chip packager through transportation. In the transportation process, the chip box is usually used to load chips. In order to ensure that the adjacent chips will not be damaged by collision, a plurality of placing strips are arr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/683H01L21/677H01L21/67H01L21/58
CPCH01L21/6838H01L21/67766H01L21/67121H01L21/50
Inventor 鲍承林姜政
Owner 江苏美斯其新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com