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Lead frame of semiconductor high-power device

A high-power device, lead frame technology, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of loss of viscosity of adhesive, short circuit, affecting the normal operation of chips, etc.

Pending Publication Date: 2021-11-23
吴秀敏
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When using the lead frame, the lead frame is used as the chip carrier of the integrated circuit. Since the chips of the integrated circuit are mostly directly glued to the lead frame, the adhesive will lose its viscosity during long-term use, making the gap between the lead frame and the chip Loose, resulting in poor contact of the circuit and short circuit, etc., affecting the normal operation of the chip

Method used

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  • Lead frame of semiconductor high-power device
  • Lead frame of semiconductor high-power device
  • Lead frame of semiconductor high-power device

Examples

Experimental program
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Effect test

Embodiment 1

[0030] see figure 1 , the present invention provides a technical solution: a lead frame of a semiconductor high-power device, the structure of which includes a push block 1, a housing 2, a fixed board 3, a positioning device 4, a lead frame 5, and a defined cavity 6. The push block 1 is fixedly connected to both sides of the inner wall of the housing 2, the housing 2 is connected to the lead frame 5, and a defined cavity 6 is installed inside the housing 2, and four blocks corresponding to it are arranged on the defined cavity 6. The fastened fixed board 3 has a positioning device 4 inside the defined cavity 6 , and the positioning device 4 is connected to the lead frame 5 through the defined cavity 6 .

[0031] see figure 2 , the positioning device 4 includes a screw 41, an adjustment guide plate 42, a limit clamp 43, a protective assembly 44, and an installation cavity 45. The two ends of the screw 41 run through two adjustment guide plates 42, and the adjustment guide pl...

Embodiment 2

[0039] see figure 1 , the present invention provides a technical solution: a lead frame of a semiconductor high-power device, the structure of which includes a push block 1, a housing 2, a fixed board 3, a positioning device 4, a lead frame 5, and a defined cavity 6. The push block 1 is fixedly connected to both sides of the inner wall of the housing 2, the housing 2 is connected to the lead frame 5, and a defined cavity 6 is installed inside the housing 2, and four blocks corresponding to it are arranged on the defined cavity 6. The fastened fixed board 3 has a positioning device 4 inside the defined cavity 6 , and the positioning device 4 is connected to the lead frame 5 through the defined cavity 6 .

[0040] see figure 2 , the positioning device 4 includes a screw 41, an adjustment guide plate 42, a limit clamp 43, a protective assembly 44, and an installation cavity 45. The two ends of the screw 41 run through two adjustment guide plates 42, and the adjustment guide pl...

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PUM

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Abstract

The invention discloses a lead frame of a semiconductor high-power device, and the structure of the lead frame comprises a pushing block, a housing, a fixed plugboard, a positioning device, a lead frame, and a limiting cavity. When the lead frame is in use, a chip is connected to the lead frame through a mounting cavity, and the position of a limiting clamping plate is adjusted through the cooperation of a screw rod and an adjusting guide plate; the protection piece can be directly attached to the chip, the limiting clamping plate can continuously move upwards, after the abutting piece and the triangular plate are pressed, pressure can be transmitted to the auxiliary element, the pressure is transmitted to the protection piece through the auxiliary element, the protection piece can wrap the outer wall of the chip to protect the outer wall of the chip, and the chip is effectively positioned and clamped; the protection piece can be stably positioned on the lead frame and is not easy to loosen, so that the chip can work normally.

Description

technical field [0001] The invention relates to the field of high-power semiconductor devices, in particular to a lead frame for high-power semiconductor devices. Background technique [0002] With the rapid development of network communication, electronic multimedia products, and informatization and intelligent technologies, most semiconductor integrated blocks need to use lead frames. It can be said that lead frames are important basic materials in the electronic information industry. Lead frames are used as integrated circuits. The chip carrier, which acts as a bridge to connect with external wires, positions the chip through the positioning element. When using the lead frame, it needs to be improved: [0003] When using the lead frame, the lead frame is used as the chip carrier of the integrated circuit. Since the chips of the integrated circuit are mostly directly glued to the lead frame, the adhesive will lose its viscosity during long-term use, making the gap between ...

Claims

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Application Information

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IPC IPC(8): H01L23/495
CPCH01L23/49541
Inventor 吴秀敏
Owner 吴秀敏