Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit board and manufacturing method thereof

A circuit board and circuit technology, applied in the direction of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of large openings, low precision, openings of insulating materials and large spacing of pads

Active Publication Date: 2021-11-23
LENOVO (BEIJING) LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the insulating material on the surface of the circuit board is generally made directly by printing ink. Due to the low precision, the reserved opening is relatively large, and the opening of the insulating material and the pad have a large distance.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0059] The following will clearly and completely describe the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0060] Such as Figure 1-Figure 3 as shown, figure 1 It is a top view of a conventional circuit board without insulating material, figure 2 for figure 1 The top view of the circuit board shown with insulating material installed, image 3 for figure 2 The sectional view of the circuit board shown in the direction A-A', the circuit board shown includes: a base 11 and an electrical connector 12 disposed on the surface of the base 11. There is also a circuit 13 on the surface of the su...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The technical scheme of the invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises a substrate; an electric connecting piece arranged on the surface of the substrate and a connecting wire connected with the electric connecting piece, wherein the electric connecting piece is used for electrically connecting an electronic element; and an insulating material which covers the connecting wire and is provided with an opening for exposing the electric connecting piece. The electric connecting piece is connected with a circuit through a connecting wire, and the surface of the substrate is provided with a plurality of diversion structures used for diversion of a liquid insulating material relative to the connecting wire.

Description

technical field [0001] The present application relates to the technical field of circuit boards, and more specifically, relates to a circuit board and a manufacturing method thereof. Background technique [0002] With the continuous advancement of science and technology, more and more electronic devices, such as mobile phones, tablet computers, smart wearable devices, and smart home devices, are widely used in people's daily life and work, providing for people's daily life and Work has brought great convenience and has become an indispensable and important tool for people today. [0003] The circuit board is used to install and connect various electronic components in electronic equipment, and is the main component of electronic equipment. The circuit board has pads for connecting fixed electronic components. Generally, the circuit board needs to cover the upper circuit with an insulating material, and reserve an opening to expose the pad. [0004] In the prior art, gener...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00H05K3/40
CPCH05K1/02H05K1/0296H05K3/00H05K3/40
Inventor 苏跃峰樊小军
Owner LENOVO (BEIJING) LTD