Manufacturing method of circuit board with embedded component

Abstract

The invention provides a manufacturing method of a circuit board with an embedded component, which comprises the steps of providing a first circuit board which comprises a first base layer, a first copper foil layer and a first conductive circuit layer, wherein the first copper foil layer and the first conductive circuit layer are formed on two opposite sides of the first base layer, and the first conductive circuit layer comprises a welding pad; electrically connecting an electronic component on the welding pad; forming at least one first blind hole in the first copper foil layer, wherein the first blind hole penetrates through the first copper foil layer and the first base layer, and the bottom of the first blind hole corresponds to the welding pad; and plating copper on the first copper foil layer to form a first copper plating layer, and etching the first copper foil layer and the first copper plating layer to obtain a fourth conductive circuit layer, thereby obtaining the circuit board with the embedded component. According to the manufacturing method of the circuit board with the embedded component, the electronic component with a small size can be embedded.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a circuit board with embedded components. Background technique [0002] In recent years, with the development of electronic equipment towards miniaturization, circuit boards and entire modules in electronic equipment are required to be miniaturized. Therefore, while optimizing the design of the circuit board to increase the wiring density of the circuit board, circuit components are buried inside the circuit board to maximize the use of the internal space of the circuit board and further realize the miniaturization of the circuit board. At present, in the embedding scheme of components, in order to avoid occupying too much circuit board wiring space due to the large size of components, components of 0201, 01005 (inch) or smaller are often used. [0003] Generally, the circuit board needs to be laser drilled and filled with conductiv...

AI Technical Summary

Problems solved by technology

[0003] Typically, a circuit board needs to be laser drilled and filled with conductive material to allow electrical continuity between the conductive terminals of the component and the circuit layers of the circuit board, however, for size Smaller components, the size of their conductive terminals cannot meet the precision requirements of laser drilling, making it impossible to embed

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