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High-speed daughter board-mother board connector

A technology of sub-motherboard and connector, applied in the direction of connection, fixed connection, two-part connection device, etc., can solve the problems of complicated BGA connection welding process, low reliability of printed board welding, difficult inspection and repair, etc., to ensure signal Contact reliability, ensuring high-speed transmission performance, and improving the effect of injection stability

Pending Publication Date: 2021-11-26
SHANGHAI AEROSPACE SCI & IND ELECTRIC APPLIANCE RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] From the perspective of transmission rate, fisheye crimping and BGA connection can produce smaller impedance discontinuity and improve the transmission rate of the connector. Therefore, these two methods are chosen by more and more connector designers. However, BGA The connection and welding process is relatively complicated, it is difficult to inspect and repair the product after welding, and the reliability of printed board welding is low

Method used

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  • High-speed daughter board-mother board connector
  • High-speed daughter board-mother board connector
  • High-speed daughter board-mother board connector

Examples

Experimental program
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Embodiment Construction

[0035] The present invention will be further explained below in conjunction with specific embodiments.

[0036] refer to Figure 1-4 , a high-speed motherboard connector, including a plug connector 1 and a socket connector 2, the plug connector 1 includes a plug shell 11, the middle part of the plug shell 11 is provided with a through mounting hole A111, and the mounting hole A111 is plugged into The plug base 12, the upper surface of the plug base 12 is provided with an insertion part 121, the installation hole A111 is matched with the insertion part 121, and the insertion part 121 is provided with a plurality of through contact sockets A122;

[0037] One side of the lower surface of the plug base 12 is vertically provided with a front support wall 123, and the other side is vertically provided with a rear support wall 125. Side wall grooves 126; the bottom of the plug housing 11 is threadedly connected to the cover plate 14, and the upper surface of the cover plate 14 is pr...

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PUM

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Abstract

The invention discloses a high-speed daughter board-mother board connector. The connector comprises a plug connector and a socket connector; the plug connector comprises a plug shell, and the middle part of the plug shell is plugged with a plug base; a plurality of contact plug-ins are detachably arranged in the plug base; and each contact plug-in comprises a plastic base, and at least four 90-degree bent plug contact pieces are arranged in the plastic base. According to the high-speed daughter board-mother board connector, the number and the size of the contact pieces can be adjusted according to actual needs, the connector is suitable for devices of different sizes, and meanwhile the high-speed transmission performance can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of electrical connectors, in particular to a high-speed sub-motherboard connector. Background technique [0002] With the rapid development of science and technology in our country, the system continues to increase the data transmission speed, and the requirements for the transmission rate of the connector are getting higher and higher, so the form of the contact is also changing, especially the connection between the contact and the printed board. The method has changed from the original through-hole soldering to fisheye crimping and BGA (Ball grid array) connection. [0003] From the perspective of transmission rate, fisheye crimping and BGA connection can produce smaller impedance discontinuity and improve the transmission rate of the connector. Therefore, these two methods are chosen by more and more connector designers. However, BGA The connection and welding process is relatively complicated, and it i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R24/00H01R12/58H01R12/71H01R13/11H01R13/405H01R13/502H01R13/646
CPCH01R24/005H01R13/646H01R13/405H01R13/111H01R12/585H01R13/502H01R12/716
Inventor 尚兴荣曹永泉
Owner SHANGHAI AEROSPACE SCI & IND ELECTRIC APPLIANCE RES INST