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Wide printing head splicing and packaging method and wide printing head packaging structure

An encapsulation method and encapsulation structure technology, which can be used in printing, electrical components, electrical solid devices, etc., can solve the problems of low production efficiency and unsatisfactory printing effect of wide-format printing products, and achieve low cost, good levelness, and high efficiency. Effect

Pending Publication Date: 2021-12-03
SHANGHAI AUREFLUIDICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a wide-format printing head splicing and packaging method and a wide-format printing head packaging structure, which are used to solve the problem of unsatisfactory printing effects and production problems of wide-format printing products in the prior art. The problem of low efficiency

Method used

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  • Wide printing head splicing and packaging method and wide printing head packaging structure
  • Wide printing head splicing and packaging method and wide printing head packaging structure
  • Wide printing head splicing and packaging method and wide printing head packaging structure

Examples

Experimental program
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Effect test

Embodiment 1

[0041] In this embodiment, a method for splicing and encapsulating a wide-format print head is provided, which includes the following steps:

[0042] S1: providing a base;

[0043] S2: Paste at least two print head chips sequentially on different positions on the upper surface of the base along the X direction, wherein the print head chip pasted in the later step and the print head chip pasted in the previous step are at least A part overlaps, the X direction and the Y direction are parallel to the upper surface of the base, and the X direction and the Y direction are perpendicular to each other.

[0044] As an example, see figure 1 , paste the three print head chips (the first print head chip 2, the second print head chip 3 and the third print head chip 4) on different positions on the upper surface of the base 1 in sequence along the X direction, wherein the last step is to paste The print head chip and the print head chip pasted in the previous step are at least partly ov...

Embodiment 2

[0057] This embodiment adopts basically the same technical solution as Embodiment 1, except that the material of the base is more optimized.

[0058] Specifically, before mounting the print head chip, the base needs to be cleaned and pre-baked after cleaning. When the base is made of plastic finishing parts, the measurement data shows that the base deforms sadly after baking, and the deformation is about 150 microns. Such as figure 2 As shown, the print head chip is a silicon-based material with good rigidity. When it is attached to the deformed base, the chip is uneven, which affects the accuracy of the chip position. A variety of plastic base materials are selected for testing, and all have different degrees of warpage.

[0059] In this embodiment, in order to achieve a deformation coefficient close to that of the print head chip material, a ceramic material is finally selected as the base. Among them, the CTE coefficient (thermal expansion coefficient) of ceramics is ab...

Embodiment 3

[0062] This embodiment adopts basically the same technical solution as Embodiment 1, except that the material of the base is more optimized, and a pre-curing step of glue is added.

[0063] Specifically, the print head chip is bonded with heat-curing glue, and the selected high-viscosity glue can prevent the chip from moving after mounting. The experiment found that the position of the chip did not move significantly after mounting, but when the chip was baked and cured in an oven at high temperature, the viscosity of the glue decreased at high temperature, and the glue reaction would cause a small displacement of the chip. Evaluating glues with different viscosities, it is still found that the chip has displacement phenomenon after baking.

[0064] In this embodiment, UV thermosetting glue is used (UV system raw materials are added to the thermosetting glue). Compared with ordinary UV glue that does not need heat curing, the UV thermosetting glue used in this embodiment is mo...

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Abstract

The invention provides a wide printing head splicing and packaging method and a wide printing head packaging structure. The method comprises the following steps: providing a base; and pasting at least two printing head chips sequentially to different positions of the upper surface of the base in the X direction, wherein at least one part of the printing head chip pasted in a next step and at least one part of the printing head chip pasted in a previous step coincide in the Y direction, the X direction and the Y direction are both parallel to the upper surface of the base, and the X direction is perpendicular to the Y direction. According to the method, the multiple printing head chips are all mounted on one base, the relative position deviation can be reduced, the levelness can be improved, and the position deviation and the levelness can be further improved by adding the pre-curing step and selecting the base with the CTE coefficient closer to that of the chips. Compared with the traditional scheme that printing head chips are respectively pasted on different small bases and then are assembled, the packaging scheme that the plurality of printing head chips are all pasted on one base is higher in efficiency and lower in cost.

Description

technical field [0001] The invention belongs to the field of industrial and consumer printing, and relates to a wide-width printing head splicing and packaging method and a wide-width printing head packaging structure. Background technique [0002] In recent years, with the advancement of wide-format inkjet printing technology, the wide-format inkjet printing market has developed rapidly and has gradually become an increasingly important technology in the fields of industrial printing and consumer printing. Wide-format inkjet printing is seeing a significant increase in demand for applications such as advertising, decoration and digital textile printing. Wide-format printing requires splicing and mounting of print head chips to achieve wide format. The traditional packaging and splicing solution is to first mount the chip on a module with a flexible board, and then splice and mount the module to form a wide-format print head. Wide splicing requires that the relative deviati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/98H01L21/50H01L23/488H01L25/065B41J2/14
CPCH01L25/50H01L25/0655H01L21/50H01L23/488B41J2/14B41J2002/14362B41J2002/14491
Inventor 王伟徐飞张华付伟欣
Owner SHANGHAI AUREFLUIDICS TECH CO LTD
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