Unlock instant, AI-driven research and patent intelligence for your innovation.

Anti-counterfeiting structure, preparation method of anti-counterfeiting structure and chip

A film structure and substrate technology, applied in the field of color rendering, can solve the problems of low resolution, poor anti-counterfeiting performance, and easy imitation of anti-counterfeiting structures, achieving high resolution and reducing pollution

Pending Publication Date: 2021-12-07
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the current technology, most of the anti-counterfeiting is carried out by coating pigments on products and using different colors of pigments. However, the resolution of traditional pigments is low, so the current anti-counterfeiting structure is easy to be imitated, and the anti-counterfeiting performance is poor.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Anti-counterfeiting structure, preparation method of anti-counterfeiting structure and chip
  • Anti-counterfeiting structure, preparation method of anti-counterfeiting structure and chip
  • Anti-counterfeiting structure, preparation method of anti-counterfeiting structure and chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] In order to better understand the above technical solutions, the technical solutions of the embodiments of the present application will be described in detail below through the accompanying drawings and specific examples. It should be understood that the embodiments of the present application and the specific features in the embodiments are the technical solutions of the embodiments of the present application. A detailed description, rather than a limitation to the technical solutions of the present application, the embodiments of the present application and the technical features in the embodiments can be combined with each other under the condition of no conflict.

[0049] Such as Figure 1 to Figure 3 with Figure 7 As shown, according to the first aspect of the embodiment of the present application, an anti-counterfeiting structure is proposed, including: a base layer 100; a plurality of raised structures 200 formed on the base layer 100, wherein the material used t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
heightaaaaaaaaaa
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The embodiment of the invention discloses an anti-counterfeiting structure, a preparation method of the anti-counterfeiting structure and a chip. The anti-counterfeiting structure comprises a substrate layer; a plurality of convex structures which are formed on the substrate layer, and the refractive index of a material for preparing the convex structures is greater than 1.4. When incident light irradiates on the anti-counterfeiting structure, the incident light and the plurality of convex structures generate a Mie resonance phenomenon, so that light rays reflected at different angles on the convex structures of the anti-counterfeiting structure are different, and then different colors are presented when the anti-counterfeiting structure is seen from different angles, so that the anti-counterfeiting effect can be realized, the anti-counterfeiting structure provided by the embodiment of the invention develops the color based on the structural color, does not need to depend on pigments, is high in resolution ratio, is difficult to imitate, does not need to depend on chemical dyes, and can reduce the pollution to the environment.

Description

technical field [0001] The embodiments of the present application relate to the technical field of color development, and in particular to an anti-counterfeit structure, a preparation method of the anti-counterfeit structure and a chip. Background technique [0002] Anti-counterfeiting structures are widely used in many commodities, and are used to identify whether a product is counterfeit or counterfeit. Most of the current technologies are anti-counterfeiting by coating pigments on products and using different colors of pigments for anti-counterfeiting. However, the resolution of traditional pigments is low, which makes the current anti-counterfeiting structure easy to be imitated and has poor anti-counterfeiting performance. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art or related art. [0004] Therefore, the first aspect of the present invention provides an anti-counterfeiting st...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G09F3/02H01L23/544H01L21/67
CPCG09F3/02H01L23/544H01L21/67282H01L2223/54433
Inventor 史丽娜尚潇李龙杰陈生琼谢常青李泠
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI