Automatic tin spraying device for PCB production

Abstract

The invention relates to an automatic tin spraying device for PCB production, the automatic tin spraying device for PCB production comprises a base, a mounting plate fixedly mounted on the side end of the base and a tin spraying box fixedly arranged on the base, and when tinning operation needs to be carried out on a PCB, the distance between clamping plates is adjusted through an adjusting mechanism, so the clamping plates are made to be matched with the PCB needing to be machined, then PCB is limited to the clamping plates through clamping assemblies, a two-way driving mechanism drives the clamping plates to drive the PCB to move towards the tin spraying box, when the PCB moves into the tin spraying box, the tin spraying head sprays tin on the surface of the PCB, in the process, the two-way driving mechanism drives the PCB to move all the time, the PCB extrudes the baffle, and the two-way driving mechanism reversely works until the PCB completely passes through the baffle. When the PCB is in contact with the plane end of the baffle, the baffle blocks the PCB, and the two-way driving mechanism drives the clamping plates to continuously move, so that the baffle is separated from the clamping plates and falls onto the conveying belt.

Description

technical field [0001] The invention relates to the related technical field of circuit board production and processing, in particular to an automatic tin spraying device for PCB board production. Background technique [0002] Printed circuit boards can be divided into tin-plated boards, gold-coated boards, silver-coated boards, OSP boards, etc. from the production process. Among them, the tin plate is a common type of PCB board, generally a multi-layer high-precision PCB board, which is used in various electronic equipment, communication products, computers, medical equipment, aerospace and other fields and products. [0003] Tin spraying is a step and process in the production process of PCB boards. Specifically, the PCB board is immersed in a molten solder pool, so that all exposed copper surfaces will be covered with solder, and then the hot air cutter will Remove excess solder on the PCB. Because the surface of the circuit board after tin spraying is the same substance...

AI Technical Summary

Problems solved by technology

However, due to its processing characteristics, the surface flatness of tin spraying treatment is not good, especially for small electronic components such as BGA packages, due to the small soldering area, if the flatness is not good, it may cause problems such as short circuits, so it needs to be flattened. A better process to solve the problem of tin plate

[0004] The existing PCB board tin spraying device usually loads and unloads the PCB board manually. During the loading and unloading process, the fixing operation of the PCB board is cumbersome, resulting in low production efficiency and high product scrap rate, which cannot reach the ideal Effect

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