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Circuit board semi-metalized hole manufacturing method

A production method and technology of metallized holes, which are applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of time-consuming and laborious, and achieve the effect of guaranteed quality and high processing efficiency.

Active Publication Date: 2021-12-10
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the existing method of making semi-metallized holes, these semi-metallized holes are often milled off with a drill or milling cutter to directly process these semi-metallized holes. Feng, in order to ensure the quality of the circuit board, these hoods are often removed in the later stage, which is time-consuming and laborious

Method used

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  • Circuit board semi-metalized hole manufacturing method
  • Circuit board semi-metalized hole manufacturing method
  • Circuit board semi-metalized hole manufacturing method

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Embodiment Construction

[0045] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings, that is, embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0046]It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thu...

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Abstract

The invention relates to the technical field of circuit board manufacturing, and provides a circuit board semi-metalized hole manufacturing method. The method comprises the following steps: providing a substrate which is provided with a metalized hole and a to-be-formed area; using a first milling cutter to machine the substrate according to a first path, wherein the first path comprises a first cutting point and a first machining point, the first cutting point is located inside or outside the plated-through hole, and the first machining point intersects with the metal side edge of the plated-through hole; and using a second milling cutter to machine the substrate according to a second path, wherein the second path intersects with the first machining point, the second path comprises a second cutting point and a second machining point, and the second cutting point and the first cutting point are located on the two sides of the metal side edge respectively. The invention also provides a circuit board. The circuit board semi-metalized hole manufacturing method can prevent the metal side edge of the semi-metalized hole from generating burrs when the semi-metalized hole is processed. The circuit board is free of burrs and high in quality.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing semi-metallized holes on a circuit board and a circuit board. Background technique [0002] When the circuit board needs to be used in communication wireless power amplifier products, it is usually necessary to design a half-metallized hole or slot in the printed circuit board. The designed half-metallized hole or slot can not only realize the conduction function of the round hole, but also Soldering and fixing through the hole wall of the half hole to realize the fixing of component pins is a conventional design in printed boards. [0003] In the existing method of making semi-metallized holes, these semi-metallized holes are often milled off with a drill or milling cutter to directly process these semi-metallized holes. Feng, in order to ensure the quality of the circuit board, these caps are often removed in the later stage, whic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0044H05K3/42
Inventor 刘文略范伟名
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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