Alternating current LED lamp filament and lamp filament lamp
A technology of LED filaments and LED chips, which is applied in the direction of electrical components, electric solid devices, circuits, etc., to achieve the effects of avoiding heat accumulation, improving life, and reducing temperature
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Embodiment 1
[0051] Please refer to figure 1 , an AC LED filament is provided in an embodiment of the present application, including a substrate 1, terminals 2 located at both ends of the substrate 1, an LED chip 3, a first resistor 4, a diode 5 and an encapsulation glue 6, and the upper surface of the substrate 1 is provided with The first circuit layer, the lower surface of the substrate 1 is provided with the second circuit layer 7, and the first circuit layer includes the end circuit area 8 of the first circuit layer, the component circuit area 9 of the first circuit layer and the parallel circuit area 10 of the first circuit layer , the first circuit layer component line area 9 is adjacent to the first line layer end line area 8 with a first insulating gap 12 arranged in the middle, and the first resistor 4 is arranged at the first line layer end of at least one end of the substrate 1 Above the line area 8 and the line area 9 of the first line layer components and covering the first i...
Embodiment 2
[0062] refer to Figure 6-8 The difference between the second embodiment and the first embodiment is that the second circuit layer 7 is disposed on the lower surface of the substrate 1 and is completely symmetrical to the first circuit layer. The first line layer is provided with a left first line layer end line area 81 and a right first line layer end line area 82, and the component line area of the first line layer is provided with a left first line layer component line area 91 and the circuit area 92 of the first circuit layer component on the right side. The second line layer 7 is provided with the left first line layer end line area 83 and the right side first line layer end line area 84, and the element line area of the second line layer is provided with the left first line layer element line area 93 and the circuit area 94 of the first circuit layer component on the right side. The second circuit layer 7 corresponds to the upper first circuit layer parallel circui...
Embodiment 3
[0066] refer to Figure 9-11 The difference between the third embodiment and the second embodiment is that: the substrate 1 is provided with a first via hole passing through the component circuit area 9 of the first circuit layer of the first circuit layer and the component circuit area of the second circuit layer 7, the first via hole Connecting metal is provided in the hole. Specifically, the first via hole includes a first metallized via hole 131 and a second metallized via hole 132 . The first metallized via hole 131 electrically connects the left first circuit layer component circuit area 91 of the first circuit layer with the left first circuit layer component circuit area 93 of the second circuit layer. The second metallized via hole 132 electrically connects the right first circuit layer component circuit area 92 of the first circuit layer with the right first circuit layer component circuit area 94 of the second circuit layer. All the other are identical with embo...
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