Power semiconductor device mounting structure and modular manufacturing method thereof

Abstract

The invention relates to a power semiconductor device mounting structure and a modular manufacturing method thereof. The power semiconductor device mounting structure comprises a power semiconductor device, a heat dissipation metal body, a heat conduction bonding insulation film and a PCB. The body of the power semiconductor device is bonded and fixed on the heat dissipation metal body through the heat conduction bonding insulation film; and the PCB and the heat dissipation metal body are vertically arranged, an insulating strip is arranged between the PCB and the heat dissipation metal body, the heat dissipation metal body is simultaneously fixed with the insulating strip and the PCB, and a pin of the power semiconductor device penetrates through the PCB and is fixed. The heat conduction bonding insulation film provided by the invention has the functions of insulation, fixation and heat conduction at the same time. The power semiconductor device, the heat dissipation metal body and the heat conduction bonding insulation film are all of flat structures, so that the space is saved; and the heat dissipation metal body, the power semiconductor device and the PCB form the power semiconductor module, so that the product is modularized, and the product is convenient to assemble, store and manage.

Description

technical field [0001] The invention relates to the technical field of power semiconductor device installation, in particular to a power semiconductor device installation structure and a modular manufacturing method. Background technique [0002] A power semiconductor device is a semiconductor device that performs power processing and has the ability to handle high voltage and high current, and is widely used in power supply devices. When the power supply device is working, a lot of heat is generated due to frequent switching, high voltage, and high current. Therefore, power semiconductor devices need to dissipate heat while maintaining insulation. The installation method of existing power semiconductor devices is as follows: a thermally conductive insulating medium is placed between the power semiconductor tube and the radiator, such as thermally conductive insulating silicone cloth or ceramic sheet and thermally conductive silicone grease, and then the power semiconductor ...

AI Technical Summary

Problems solved by technology

However, there are some problems in fixing power semiconductor devices by mechanical fastening. For example, when screws are used for fixing, the thermally conductive insulating medium at the position of the screw mounting hole is squeezed, twisted and damaged, resulting in insulation failure; The device is deformed or even cracked by force; the mechanical fastening structure occupies valuable product space, resulting in limited high-density layout of the device, etc., and the assembly process is complicated and the insulation reliability is poor

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