Full-automatic wafer adhesive film ring cutting device
A fully automatic and circular cutting technology, applied in the semiconductor field, can solve problems such as low efficiency and scratching workers' fingers, and achieve the effect of ensuring precise processing, adjustable circular cutting size, and eliminating the risk of injury
Pending Publication Date: 2021-12-21
海宁幻威电子科技有限公司
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Problems solved by technology
However, at present, most of them use manual pasting and ring cutting operations to paste the film on the surface of the wafer patch ring and perform ring cutting. While the efficiency is low, there is also the risk of scratching the workers' fingers.
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[0047] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0048] Wherein the same components are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "bottom" and "top "Face", "inner" and "outer" refer to directions toward or away from, respectively, the geometric center of a particular component.
[0049] As shown in the figure, a fully automatic wafer film ring cutting device includes a workbench 1, and both ends of the workbench 1 are provided with storage tables, and the storage tables are respectively equipped with an L-shaped film feeding box 2 and a pulling device 3. A feeding device 4 and a ring cutting device 5 are provided above the worktable 1, and a feeding device 6 is provided below the workbench 1; the feeding device 4 is close to the film ...
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The invention discloses a full-automatic wafer adhesive film ring cutting device, relates to the technical field of semiconductors, and aims to solve the technical problems of low efficiency and low operation safety coefficient when an adhesive film is adhered to the surface of a wafer patch ring and ring cutting is carried out. According to the technical scheme, the device comprises a workbench, and is characterized in that a film feeding box and a traction device are arranged at the two ends of the workbench respectively; a feeding device and a ring cutting device are arranged above the workbench, and a discharging device is arranged below the workbench; and the feeding device is close to the film feeding box, the ring cutting device is close to the traction device, and the discharging device is located below the ring cutting device. The invention aims to provide the full-automatic wafer adhesive film ring cutting device which is efficient in adhesion and ring cutting and higher in operation safety coefficient.
Description
technical field [0001] The invention relates to the technical field of semiconductors, more specifically, it relates to a fully automatic wafer adhesive film ring cutting device. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8-inch and 12-inch. [0003] In semiconductor wafer processing, a wafer patch ring is used. The wafer patch ring is first pasted with a layer of adhesive film (blue film is often used) on one of the surfaces, and then the excess adhesive film is removed by cutting with a knife. The wafer mounting ring is fixed to the wafer with an adhesive film to f...
Claims
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IPC IPC(8): B29C65/48B29C65/74B29C65/78
CPCB29C65/48B29C65/74B29C65/7841B29C65/7858B29C66/0326B29C66/744
Inventor 黄松龙
Owner 海宁幻威电子科技有限公司