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Exposure device

An exposure device and a technology for exposing objects, which are applied in photolithography exposure devices, microlithography exposure equipment, optics, etc., can solve problems such as reduced productivity, damage, and reduced light transmittance, so as to improve productivity and reduce costs Effect

Pending Publication Date: 2021-12-21
BEAC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the light transmittance will decrease due to deterioration, damage, or adhesion of dust on the special conveyor belt.
[0013] Moreover, in the second example above, the light will be shielded between the substrates being transported to the first workbench and the second workbench, resulting in stopping the irradiation of the exposure light, so there is also control brought by intermittent conveyance. Issues that become more complex leading to lower productivity

Method used

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0069] Figure 7 It is a front view of the schematic structure of the exposure apparatus 1, Figure 8 It is a plan view of a schematic configuration of the exposure apparatus 1 . in addition, Figure 8 The illustration of the exposure light irradiation mechanism 30 is omitted. The exposure apparatus 1 uses a first photomask 11A corresponding to a first exposure target region 14A that divides an exposure light target region 14 arranged in series on the elongated photosensitive substrate 10 into two, and a second photomask 11A corresponding to a second exposure target region 14B. The second photomask 11B is used, and the mask patterns 17A, 17B are transferred onto the substrate 10 to form the transfer pattern 12 .

[0070] The exposure apparatus 1 has a first stage 25 disposed upstream in the transport direction of the substrate 10 (from left to right in the drawing) and a second stage 26 disposed downstream. The first stage 25 and the second stage 26 respectively absorb and...

no. 2 approach

[0099] Refer below Figure 10 The structure of the exposure apparatus 2 of 2nd Embodiment is demonstrated. The difference of the exposure device 2 is that, compared with the above-mentioned exposure device 1, there are exposure light irradiation mechanisms 30A, 30B respectively corresponding to the first workbench 25 and the second workbench 26, while the exposure device 2 uses the exposure light irradiation mechanism 35 The exposure light 50 is irradiated by switching the optical path between the first stage 25 side and the second stage 26 side. In addition, the present embodiment will be described using an example in which the first photomask 11A and the second photomask 11B are used as photomasks as a representative.

[0100] Figure 10 It is a front view of the schematic structure of the exposure apparatus 2. Since the exposure apparatus 2 has the same structure as the exposure apparatus 1 except the exposure light irradiation mechanism 35, the structure and operation|mov...

no. 3 approach

[0115] Next, refer to Figure 12 to Figure 14 The configuration of the exposure apparatus 3 of the third embodiment will be described. In the exposure device 3, the above-mentioned exposure devices 1 are arranged in parallel in two rows, and the exposure light irradiation mechanisms 55A, 55B (refer to Figure 9 ) An apparatus for transferring the mask patterns 17A, 17B or the mask patterns 24A, 4B onto the substrate 10 . One of the two exposure lines is the first exposure line 60 and the other is the second exposure line 61 . In the following description, the example which uses photomask 11A, 11B is demonstrated as a representative example.

[0116] Figure 12 is a schematic plan view of the structure of the exposure device 3, Figure 13 is used to illustrate from Figure 12 An explanatory diagram of the structure and operation of the exposure light irradiation mechanism 55A on the first table 25 side when viewed from the left (thick arrow direction) of . Figure 14 is u...

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Abstract

An exposure device 1 divides a region to be exposed 14 into a first region to be exposed 14A and a second region to be exposed 14B, and transfers mask patterns 17A, 17B to a substrate 10 by a first photomask 11A corresponding to the first region to be exposed 14A and a second photomask 11B corresponding to the second region to be exposed 14B. The exposure device 1 comprises: an alignment mechanism 28 which has a first stage 25 and a second stage 26 that are connected in series, and performs relative alignment between the substrate 10 and the photomasks 11A, 11B; and exposure light irradiation mechanisms 30A, 30B which switchingly irradiate the first photomask 11A and the second photomask 11B with light emitted from a light source 45 as exposure light 50. The exposure device 1 makes it possible to reduce cost for photomasks, and highly accurately transfer mask patterns to a large-sized substrate.

Description

technical field [0001] The present invention relates to an exposure device. Background technique [0002] Conventionally, when forming a circuit pattern on a substrate or the like by a photolithography process, an exposure device is used to expose a photosensitive material on the substrate through a photomask to transfer the mask pattern onto the substrate. In recent years, along with the increase in size of the substrate, the size of the photomask has gradually increased. However, the cost of a photomask depends on its planar size, and the increase in size of the photomask increases the cost. In addition, in the batch exposure process using a large-sized photomask, there is also a problem that it is difficult to ensure the accuracy of the outer peripheral portion with respect to the central portion of the substrate. Therefore, there is an exposure apparatus that divides an exposure target area of ​​a substrate, uses a photomask corresponding to the divided exposure target...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00
CPCG03F7/70716G03F7/70733G03F9/7003G03F7/20G03F9/00
Inventor 河东和彦羽生慎一
Owner BEAC