A substrate processing device for semiconductor production

Abstract

The invention provides a substrate processing device for semiconductor production, which relates to the technical field of semiconductor production equipment, including a base, two transmission frames are provided on the left side of the top of the base; a polishing cylinder is provided on the right side of the transmission frame; A rotating seat is provided in the middle of the polishing cylinder, and a polishing turntable is provided on the rotating seat; a driving mechanism is provided at the bottom of the base, and a collecting assembly is provided on the right side of the driving mechanism. In the present invention, there is no need for complicated drive and control components, as long as the double-head motor is controlled, the transportation and polishing of the silicon wafer can be regulated, and the upper and lower sides of the silicon wafer are simultaneously polished, thereby saving the process of changing the surface of the silicon wafer. Greatly improve the polishing efficiency, and solve the low efficiency of single-side single-side polishing of silicon wafers. In addition, multiple sets of control and driving mechanisms are required for transportation and polishing. The cost and power consumption of the equipment are high. At the same time, the residue generated by polishing is easily adsorbed on the surface of the silicon wafer. , The cleaning process is more troublesome.

Description

technical field [0001] The invention relates to the technical field of semiconductor production equipment, in particular to a substrate processing device for semiconductor production. Background technique [0002] Silicon wafers are the base material of semiconductor substrates. During the production and processing of silicon wafers, they need to go through procedures such as rough grinding, chemical etching, and polishing to become semiconductor substrate substrates. [0003] However, as far as the current traditional substrate processing devices for semiconductor production are concerned, most of them need to increase the process of surface-changing polishing to complete the single-side polishing of silicon wafers, resulting in low polishing efficiency, and manual pushing is time-consuming and laborious. It cannot meet the production needs of automatic polishing processing well. In addition, multiple sets of control and driving mechanisms are required for transportation an...

AI Technical Summary

Problems solved by technology

[0003] However, as far as the current traditional substrate processing devices for semiconductor production are concerned, most of them need to increase the process of surface-changing polishing to complete the single-side polishing of silicon wafers, resulting in low polishing efficiency, and manual pushing is time-consuming and laborious. It cannot meet the production needs of automatic polishing processing well. In addition, multiple sets of control and driving mechanisms are required for transportation and polishing, resulting in a complex overall structure of the equipment, high equipment cost and power consumption, and at the same time, the residue generated by polishing is easily adsorbed on silicon. Wafer surface, the cleaning process is more troublesome

Images