Substrate processing device for semiconductor production

Abstract

The invention provides a substrate processing device for semiconductor production, and relates to the technical field of semiconductor production equipment. The substrate processing device comprises a base, and two transmission frames are arranged at the left side of the top of the base; a polishing barrel is arranged at the right sides of the transmission frames; a rotating seat is arranged in the middle of the polishing barrel, and a polishing turntable is arranged on the rotating seat; and a driving mechanism is arranged at the bottom of the base, and a collecting assembly is arranged at the right side of the driving mechanism. Complex driving and control assemblies are not needed, conveying and polishing of a silicon wafer can be regulated and controlled only by controlling a double-end motor, and the upper face and the lower face of the silicon wafer are polished at the same time, so that the procedure of face changing and polishing of the silicon wafer is omitted, the polishing efficiency is greatly improved, and the problems that the single-time single-face polishing efficiency of the silicon wafer is low, in addition, a plurality of control and driving mechanisms are needed in cooperation with conveying and polishing, the manufacturing cost and power consumption of the device are high, residues generated by polishing are easily adsorbed on the surface of the silicon wafer, and the cleaning process is troublesome are solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor production equipment, in particular to a substrate processing device for semiconductor production. Background technique [0002] Silicon wafers are the base material of semiconductor substrates. During the production and processing of silicon wafers, they need to go through procedures such as rough grinding, chemical etching, and polishing to become semiconductor substrate substrates. [0003] However, as far as the current traditional substrate processing devices for semiconductor production are concerned, most of them need to increase the process of surface-changing polishing to complete the single-side polishing of silicon wafers, resulting in low polishing efficiency, and manual pushing is time-consuming and laborious. It cannot meet the production needs of automatic polishing processing well. In addition, multiple sets of control and driving mechanisms are required for transportation an...

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Problems solved by technology

[0003] However, as far as the current traditional substrate processing devices for semiconductor production are concerned, most of them need to increase the process of surface-changing polishing to complete the single-side polishing of silicon wafers, resulting in low polishing efficiency, and manual pushing is time-consuming and laborious. It cannot meet the production needs of automatic polishing processing well. In addition, multiple sets of control and driving mechanisms are required for transportation and polishing, resulting in a complex overall structure of the equipment, high equipment cost and power consumption, and at the same time, the residue generated by polishing is easily adsorbed on silicon. Wafer surface, the cleaning process is more troublesome

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