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Electronic information transmission device convenient to install

A transmission device and electronic information technology, applied in the direction of printed circuits, circuits, electrical components, etc. connected to non-printed electrical components, can solve the problems of semiconductor chip stack structure peeling damage, unfavorable chip heat dissipation, and low bonding strength, etc., to achieve Improve bonding stability, strong bonding stability, and rapid heat dissipation

Inactive Publication Date: 2021-12-24
王结虎
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conventional semiconductor chip stack structure has low bonding strength and is not conducive to the heat dissipation of the chip. When the semiconductor chip stack structure is assembled into an electronic information transmission device, it is easy to cause peeling damage of the semiconductor chip stack structure, which is not easy to install

Method used

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  • Electronic information transmission device convenient to install
  • Electronic information transmission device convenient to install
  • Electronic information transmission device convenient to install

Examples

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Embodiment Construction

[0028] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0029] like Figure 1 to Figure 10 As shown, this embodiment provides a method for preparing an electronic information transmission device that is easy to install, including the following steps:

[0030] In a specific example, such as figure 1 As shown, a first carrier substrate 100 is provided, and a first semiconductor die 101 is provided on the first carrier substrate 100, and the first semiconductor die 101 includes an active su...

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Abstract

The invention relates to an electronic information transmission device convenient to install and a preparation method thereof. A plurality of parallel first grooves are formed in a non-active surface of a first semiconductor tube core, a first protrusion is formed between every two adjacent first grooves, a plurality of parallel second grooves are formed in a non-active surface of a second semiconductor tube core, and a second protrusion is formed between every two adjacent second grooves, so that in a bonding step, each first protrusion is embedded into the corresponding second groove, and each second protrusion is embedded into the corresponding first groove, so an annular groove can be formed in the side face of the bonding position of the first semiconductor die and the second semiconductor die, and a metal heat dissipation component is formed in the annular groove. Through the arrangement of the structure, the bonding stability of the first semiconductor tube core and the second semiconductor tube core can be improved, formation of a metal heat dissipation component is facilitated, and then the working stability of the electronic information transmission device is improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to an electronic information transmission device that is easy to install. Background technique [0002] In existing electronic information transmission devices, it is necessary to set stacked semiconductor chips as functional elements, and in the existing semiconductor chip stack structure, usually the conductive pads of one semiconductor chip are directly bonded to the conductive pads of another semiconductor chip. The electric pad, and then carry out electric lead-out. Conventional semiconductor chip stack structures have low bonding strength and are not conducive to chip heat dissipation. When the semiconductor chip stack structures are assembled into electronic information transmission devices, the semiconductor chip stack structures are likely to be peeled off and damaged, making installation inconvenient. Contents of the invention [0003] The purpose of the present i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L23/488H01L23/367H01L23/373H05K1/18
CPCH01L24/82H01L24/03H01L23/367H01L23/3736H01L24/08H05K1/181H01L2224/0231H01L2224/02331H01L2224/02333H01L2224/02381H01L2224/08145
Inventor 王结虎赵修美
Owner 王结虎
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