Quick-assembly plug-in module with quick heat conduction function

Abstract

The invention discloses a quick-assembly plug-in module with a quick heat conduction function, and belongs to the technical field of mechanical and electrical products. The plug-in module comprises a plug-in main board, a heat conduction module and a cover plate, the cover plate, the heat conduction module and the plug-in main board are detachably connected together, the plug-in main board is located between the heat conduction module and the cover plate, a connector is arranged at one end of the plug-in main board, and locking strips are arranged on the two sides of the heat conduction module. The heat insulation layer and the tubular wick infiltrated by the Freon liquid are arranged in the closed tube shell to form the heat conduction tube set, the heat conduction tube set can automatically and independently operate to conduct heat generated by the chip to the edge of the heat conduction die body so as to further dissipate heat, the heat conduction effect is good, and the running cost of the plug-in module is low. The Freon liquid is sealed in the pipe shell, and due to the fact that weak links such as mutual connection of pipelines do not exist, the Freon liquid does not leak, and the heat conduction pipe set is high in safety and long in service life.

Description

technical field [0001] The invention relates to a fast-installation plug-in module with fast heat conduction function, which belongs to the technical field of electromechanical products. Background technique [0002] Among many electromechanical products, some power chips and power chips will generate high heat when a large current flows through them. If the chip continues to overheat for a long time, it will often affect the performance of the chip, and even cause the chip to burn out in severe cases, affecting product quality. and safe. [0003] The Chinese patent document with the publication number CN107172863A discloses a blind plug-in liquid cooling module, which adopts a forced liquid cooling method, through which the cooling liquid flows through the interior of the liquid cooling cavity, and the heat of the components on the printed board is conducted to the adjacent On the liquid cooling chamber, the cooling liquid flowing on the built-in liquid cooling pipeline is...

AI Technical Summary

Problems solved by technology

[0005] First, the forced liquid cooling method is used to conduct heat conduction on the components on the printed board, which requires the installation of supporting equipment such as chillers and water pumps, which leads to a significant increase in the operating cost of the module;

[0006] Second, the liquid cooling method has extremely high requirements on the sealing of the pipe connection. If the liquid leaks, it will cause the module to be short-circuited and burned, and the safety risk is great.

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