Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Computer host with good heat dissipation effect

A computer mainframe and heat dissipation effect technology, applied in the field of network communication, can solve problems such as increased maintenance times, main body damage, user's leg body collision, etc., to improve safety and reliability, reduce the probability of damage, and improve fluency Effect

Inactive Publication Date: 2021-12-28
广州相佳数码科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing computer mainframe is in use, it is usually placed under the desktop, causing the user's legs to easily collide with the main body, which not only easily causes the user to be injured, but also easily causes damage to the main body, increasing the number of maintenance , thereby increasing the cost and reducing the safety and reliability of the existing computer host, not only that, after the existing computer host is used for a long time, the dust in the air is very easy to adhere to the fan blades, thus affecting the rotation of the fan blades effect, thereby affecting the heat dissipation effect of the main body, thereby reducing the practicality of the existing computer host

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Computer host with good heat dissipation effect
  • Computer host with good heat dissipation effect
  • Computer host with good heat dissipation effect

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The present invention will now be described in further detail with reference to the drawings. These figures are schematic diagrams, which will be described only in a schematic manner, and therefore it only shows the configurations related to the present invention.

[0024] like figure 1 As shown in a host computer a good cooling effect, including 1, heat dissipation bodies, two collision means a body side 1 is uniformly provided with cooling holes, two collision means are provided in the body 1 and on cooling holes adjacent sides of the heat radiating means disposed inside the main body 1, the collision avoidance mechanism is connected with the heat radiating means, the inner body 1 is provided with the PLC;

[0025] PLC, the programmable logic controller, generally used for data processing and reception and output of instructions for central control.

[0026] The cooling effect of a good anti-collision mechanism by the host computer, realized shock absorption cushioning fu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a computer host with a good heat dissipation effect. The computer host comprises a main body, a heat dissipation mechanism and two anti-collision mechanisms, each anti-collision mechanism comprises an anti-collision plate, a connecting assembly and two shielding assemblies, the connecting assembly comprises an air bag, a connecting pipe and a plurality of first springs, the heat dissipation mechanism comprises a rotating assembly, a cleaning assembly and a plurality of fan blades, and the cleaning assembly comprises a power unit and a plurality of cleaning units. According to the computer host with the good heat dissipation effect, through the anti-collision mechanisms, the damping and buffering functions are achieved, the impact force generated when a user collides with the anti-collision plate is reduced, and meanwhile, direct contact with the main body is avoided, so the probability that the main body is damaged can be reduced, and the safety and reliability of equipment are improved; and by means of the heat dissipation mechanism, the function of removing dust on the fan blades is achieved, the situation that the rotation effect of the fan blades is affected due to dust accumulation on the fan blades is prevented, so the heat dissipation effect in the main body is prevented from being affected, and the reliability of the equipment is improved.

Description

Technical field [0001] The present invention relates to the field of network communications, particularly to a host computer a good heat dissipation effect. Background technique [0002] Host refers to a computer to remove the main body portion other than the input and output devices, but also for placing the control board and the housing of the other major components (Mainframe containers), generally includes a CPU, memory, motherboard, hard disk, optical drive, power supply, chassis, cooling system and other input and output controller interfaces, network technology is sending and receiving information about the terminal device. [0003] Existing mainframe computers in use, are usually placed under the table, leading to the legs and the body of the user can easily collide, not only could easily lead to situations of injury to the user, but also cause damage to the body, increasing the number of maintenance , thereby increasing the cost and reduce the safety and reliability of e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/183G06F1/20
Inventor 卢安珍
Owner 广州相佳数码科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products