Film thickness measuring apparatus, film forming apparatus, film thickness measuring method, electronic device manufacturing method, and storage medium
A measuring device and film thickness technology, which is applied in semiconductor/solid-state device manufacturing, measuring devices, electric solid-state devices, etc., can solve problems such as the influence of measurement accuracy and changes in measurement conditions, and achieve the effect of suppressing the reduction of measurement accuracy
Pending Publication Date: 2021-12-28
CANON TOKKI CORP
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Problems solved by technology
As a result, the measurement conditions at the time of film thickness measurement are changed, which may affect the measurement accuracy.
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[0159] In the above-described embodiment, the storage unit 3112 stores the substrate information in association with the adjustment by the adjustment unit 173 . However, these pieces of information may also be managed collectively by the high-level device 300 .
[0160] In addition, in the above-described embodiment, the processing unit 3111 acquires board information from the host device 300 through communication (step S1). However, the acquisition of the substrate information by the processing unit 3111 may be performed in another manner. For example, the camera 163 or a camera separately installed in the transfer chamber 308 may detect the presence or absence of the orientation flat OF, and the processing unit 3111 may acquire the board information based on the detection result. In addition, for example, a code indicating the substrate information may be given to each substrate 100 in advance, and the processing unit 3111 may obtain the substrate information by reading the...
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The invention relates to a film thickness measuring apparatus, a film forming apparatus, a film thickness measuring method, a method of manufacturing an electronic device, and a storage medium. It is possible to suppress a decrease in the measurement accuracy of the film thickness of a substrate cut from a large substrate. The film thickness measuring apparatus is provided with: a substrate support member that supports any one of a plurality of substrates obtained by dividing a large substrate; a measurement member for optically measuring the film thickness of the film formed on the substrate supported by the substrate support member; and a control member that controls the measurement member. The acquisition member acquires substrate information relating to a portion of the large substrate before the substrate supported by the substrate support member is divided. The control member determines the measurement conditions of the measurement member on the basis of the substrate information acquired by the acquisition member.
Description
technical field [0001] The present invention relates to a film thickness measuring device, a film forming device, a film thickness measuring method, a manufacturing method of an electronic device, and a storage medium. Background technique [0002] The manufacturing process of an organic EL display or the like includes a film forming process of forming a film on a substrate. Furthermore, in order to confirm the film thickness of the film formed in the film forming step, the film thickness of the film formed on the substrate may be measured by an optical method (Patent Document 1). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese PCT Publication No. 2012-502177 [0006] The problem to be solved by the invention [0007] An organic EL display is manufactured by forming multiple layers on a substrate through various film formation processes. At this time, depending on the situation of the production line, a large substrate (also ...
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IPC IPC(8): H01L21/66H01L51/56H01L27/32H10K99/00
CPCH01L22/12H10K59/12H10K59/1201H10K71/00H01L21/681H01L21/67294G01B11/0616H10K71/70
Inventor 佐藤祐希小林康信谷和宪
Owner CANON TOKKI CORP