Photo-thermal integrated radiator

Abstract

The invention provides a photo-thermal integrated radiator. The photo-thermal integrated radiator comprises a light source bearing part, a heat dissipation part and a condensation cover plate, wherein the light source bearing part comprises a light source substrate, the light source substrate is used for emitting light, and the light source bearing part can conduct out heat generated by the light source substrate; the heat dissipation part comprises a connecting hole, the connecting hole is a through hole, the light source bearing part covers one end of the connecting hole, and the heat dissipation part is used for dissipating transferred heat; the condensation cover plate is used for covering the other end of the connecting hole to form a vacuum cavity, and the vacuum cavity is filled with a phase change working medium; and the phase change working medium can receive heat generated by the light source substrate and transfer the heat to the heat dissipation part.

Description

Technical field [0001] The present disclosure relates to the field of heat dissipation cooling, and more particularly to a photothermal integrated radiator. Background technique [0002] The traditional high-power lamp is consumed, low light effect, short life, and urgently need high power high power density LED lamps replace traditional lighting products. However, the input power of the LED light source is 70% to 80% to heat, and the accumulation of high heat generation will cause the LED chip to rise, which in turn leads to the drift of the light-spectral line, low efficiency, and shortening life. Therefore, heat dissipation is a key bottleneck problem that limits the development of high power high power density LED devices. At present, the heat dissipation capacity of material cooling and heat pipes in the market is very limited, and it is difficult to achieve high-power high power density LED efficient and high reliability management. [0003] The microbial groove group phase...

AI Technical Summary

Problems solved by technology

[0004] However, in the previous design of heat sinks for LED lamps, the gap between the heat-taking surface of the micro-groove group heat sink and the LED light source substrate can only be filled with interface materials such as thermally conductive silicone grease and thermally conductive silica gel. The large interface thermal resistance severely limits the micro-groove The heat extraction capacity of the group radiator, and then make the surface temperature of the light source higher, which seriously affects the light efficiency and service life of the LED light source

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