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A thermally conductive material with selective metal deposition and its preparation method and application

A technology of thermally conductive filler and metal, applied in the field of resin composition, to achieve the effects of prolonging the life of LED lighting, efficient heat dissipation, and eliminating interface thermal resistance

Inactive Publication Date: 2016-08-03
KINGFA SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The commonly used laser-sensitive additive is a spinel containing metallic copper, which also contains heavy metal chromium. Under the action of laser, heavy metal chromium has the potential environmental risk of being transformed into hexavalent chromium (toxic)

Method used

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  • A thermally conductive material with selective metal deposition and its preparation method and application
  • A thermally conductive material with selective metal deposition and its preparation method and application
  • A thermally conductive material with selective metal deposition and its preparation method and application

Examples

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preparation example Construction

[0085] The preparation method of resin composition of the present invention is as follows:

[0086]Weighing materials: 15-60wt% thermoplastic, or thermosetting plastic, or rubber, or elastomeric resin matrix; 30-70wt% thermally conductive filler; 1-10wt% metal oxide solid solution; 0-15wt% other additives ;

[0087] Mixed materials: Add resin matrix, thermal conductive filler, metal oxide solid solution, and other additives into the high-speed mixer and mix evenly;

[0088] The obtained mixed material is extruded by a twin-screw extruder, cooled, and pelletized to obtain the target product; or the obtained mixed material is loaded into a mold, and heated and pressed to obtain the target product.

[0089] The resin composition of the present invention is mainly used to make electrical and electronic components, including circuit substrates, such as electronic components, support materials for electronic components, bases for high-power LED lamps or circuit boards.

[0090] In...

Embodiment 1

[0094] Polydecanediamide 35wt% is used as the resin matrix, 30wt% boron nitride and 20wt% magnesium oxide are used as thermal conductive fillers, 5wt% metal oxide solid solution, the solvent of the metal oxide solid solution is manganese oxide and the solute is cuprous A blend of oxides, the weight ratio of solvent to solute is 7:2, other additives are 2wt% nano-alumina and 8wt% glass fiber.

Embodiment 2

[0096] The resin matrix is ​​made of polydecanediamide, 30wt%, the thermal conductive filler is made of boron nitride 30wt% and magnesium oxide 20wt%, the metal oxide solid solution is 10wt%, the metal oxide solid solution solvent is tin oxide and the solute is antimony A blend of oxides, the weight ratio of solvent to solute is 3:2, other additives are 2wt% nano-alumina and 8wt% glass fiber.

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Abstract

The invention relates to a resin composition, and particularly relates to a thermal conducting resin composition having a laser direct structuring function, a preparation method of the resin composition and applications of the resin composition. The resin composition comprises 15-60 wt% of resin matrix, 30-70 wt% of a thermal conducting filling material, 1-10 wt% of metal oxide sosoloid, and 0-15 wt% of other additives. The resin composition has excellent high-temperature resistance and good thermal conductivity, and is capable of selectively depositing copper, nickel, gold, and other metal in a laser scanned area. The resin composition can be used for workpieces of surface mounting technology (SMT), and is mainly used for the field of electronic and electrical components.

Description

technical field [0001] The invention relates to a resin composition, in particular to a thermally conductive resin composition with the function of laser direct structuring (Laser Direct Structuring), a preparation method thereof and an application of the resin composition. Background technique [0002] Laser direct structuring (LDS) technology refers to the use of computer to control the laser scanning area, irradiate the laser light on the workpiece containing laser sensitive additives, activate the circuit pattern, and the activated area on the workpiece can be electroless electroless plating Deposit metals such as copper, nickel, gold, etc., so as to realize the manufacture of conductive patterns on three-dimensional plastic parts. [0003] With the rapid development of laser direct structuring (LDS) technology, the production speed of molded interconnect devices (MouldedInterconnectDevice) is faster, the process is more simplified, the cost is more controllable, and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/06C08L81/02C08L101/12C08L77/02C08L23/12C08L63/02C08K13/02C08K3/22
CPCC08K3/22C08K3/28C08K3/38C08K13/04C08K2003/222C08K2003/2296C08K2003/282C08K2003/385C08L77/02C08L77/06C08L2201/08C08L2203/20C08L2205/025C08L81/02C08L101/00C08L23/12C08L63/00
Inventor 严峡姜苏俊龙杰明易庆锋蒋智强宁方林陈大华
Owner KINGFA SCI & TECH CO LTD
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