A Thermoset High Thermal Conductivity Insulation and Flame Retardant Composite with Laser Induced Metallization Properties

A flame-retardant composite material, laser-induced technology, applied in heat exchange materials, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc. Elimination of processing steps, elimination of interface thermal resistance, good bonding effect

Active Publication Date: 2017-02-22
HEFU NEW MATERIAL TECH WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can reduce the interface thermal resistance to a certain extent, it still cannot avoid the existence of interface thermal resistance.
Moreover, the thermal conductivity of the aluminum substrate is around 1.0w / (m·k). As the industry's requirements for LED power and heat dissipation continue to increase, this method has begun to affect the overall heat dissipation effect.

Method used

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  • A Thermoset High Thermal Conductivity Insulation and Flame Retardant Composite with Laser Induced Metallization Properties
  • A Thermoset High Thermal Conductivity Insulation and Flame Retardant Composite with Laser Induced Metallization Properties
  • A Thermoset High Thermal Conductivity Insulation and Flame Retardant Composite with Laser Induced Metallization Properties

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037]A thermosetting high thermal conductivity insulating flame-retardant composite material with laser-induced metallization properties, its formula is shown in Table 1, wherein the thermosetting resin matrix is ​​unsaturated polyester resin (epoxy acrylic resin, commercially available), and the initiator is TBPO (over Oxygenated (2-ethyl) tert-butyl hexanoate, commercially available), the internal release agent is zinc stearate, and the reinforcing fiber is an alkali-free chopped glass fiber with a length of 4-10mm and an aspect ratio of 8 :1 to 5:1, micron-scale tin-containing compounds (0.5-30μm): zinc hydroxystannate.

[0038] Materials and product preparation steps are the same as Comparative Example 1. The relevant test results are shown in Table 1.

Embodiment 2

[0040] A thermosetting high thermal conductivity insulating flame-retardant composite material with laser-induced metallization properties, its formula is shown in Table 1, wherein the thermosetting resin matrix is ​​unsaturated polyester resin (epoxy acrylic resin, commercially available), and the initiator is TBPB (over Oxidized tert-butyl benzoate, commercially available), the internal release agent is calcium stearate, and the reinforcing fiber is an alkali-free chopped glass fiber, its length is 4-10mm, and the aspect ratio is at 8:1 to 5:1 , Micron-scale tin-containing compound (0.5-30 μm): a mixture of zinc hydroxystannate and zinc stannate at a mass ratio of 1:1.

[0041] Materials and product preparation steps are the same as Comparative Example 1. The relevant test results are shown in Table 1.

Embodiment 3

[0043] A thermosetting high thermal conductivity insulating flame-retardant composite material with laser-induced metallization properties, its formula is shown in Table 1, wherein the thermosetting resin matrix is ​​unsaturated polyester resin (epoxy acrylic resin, commercially available), and the initiator is TBPO (over A mixture of (2-ethyl) tert-butyl hexanoate) and TBPB (tert-butyl peroxybenzoate) in a mass ratio of 1:1, the internal mold release agent is zinc stearate, and the reinforcing fiber is alkali-free Chopped glass fibers, the length of which is 4-10mm, the aspect ratio is 8:1 to 5:1, micron-scale tin-containing compound (0.5-30μm): tin dioxide.

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Abstract

The invention discloses a thermoset high-thermal-conductivity insulating flame-retardant composite material with laser-induced metallization characteristics. The thermoset high-thermal-conductivity insulating flame-retardant composite material is prepared by mixing the following components in percentage by weight: 15-60 percent of a thermoset resin matrix, 0.1-0.5 percent of an initiator, 0.5-1.5 percent of an internal releasing agent, 0-4.0 percent of pigments, 0-8 percent of reinforcing fibers, 3-20 percent of a tin-containing compound and 30-60 percent of heat-conducting filler. The composite material disclosed by the invention has excellent mechanical property, can realize laser-induced metallization and has the advantages of good high-temperature resistance, insulating properties and flame-retardant property and low cost.

Description

technical field [0001] The invention relates to a thermosetting composite material, in particular to a thermosetting high thermal conductivity insulating flame-retardant composite material with laser-induced metallization properties. Background technique [0002] LDS (Laser-Direct-structuring laser direct forming three-dimensional circuit), also known as SEA (The Stereo Electronic Assembly Process) in China is a technology that deposits precision and compact metal on the surface of plastic. Electronic components can be directly welded on the curved surface of plastic parts to form stereo circuit. The invention and industrialization of plastic (also known as plastic, high molecular compound, high polymer, polymer) is a milestone contribution in the history of industrial development. In the field of electronic devices, new devices such as polymer lithium batteries, polymer luminescence, polymer rollable display screens, polymer chip resistance devices, and polymer magnetic an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08L63/00C08L67/06C08L63/10C08L51/08C08K13/04C08K3/22C08K3/38C08K3/28C08K7/14C08K5/098C09K5/14F21V29/87F21Y115/10
CPCC08K3/22C08K3/24C08K3/38C08K5/098C08K5/14C08K7/14C08K13/04C08K2003/2227C08K2003/2231C08K2003/382C08K2201/003C08K2201/004C08K2201/014C08K2201/016C08L2201/02F21Y2101/00C08L63/10C08L67/06C08L63/00C08L79/08
Inventor 邹湘坪徐贵平王俊龙李晓强
Owner HEFU NEW MATERIAL TECH WUXI
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