Heat dissipation mechanism and server

Abstract

The invention discloses a heat dissipation mechanism. The mechanism comprises a heat dissipation substrate connected with a heating component, a plurality of heat dissipation fins arranged on the surface of the heat dissipation substrate and used for natural heat dissipation, a flow channel arranged in the heat dissipation substrate and used for circulating flow of cooling liquid, and a liquid cooling distribution unit communicating with a water inlet and a water outlet of the flow channel and used for controlling the flow of the cooling liquid. The mechanism also comprises a temperature sensor in signal connection with the liquid cooling distribution unit and used for detecting the temperature of the heating component, wherein when the detection value of the temperature sensor is higher than a first target threshold value, the liquid cooling distribution unit outputs cooling liquid into the flow channel. Therefore, two heat dissipation modes including a pure natural heat dissipation mode and a natural heat dissipation and cold plate heat dissipation composite mode simultaneously exist, the configuration cost and energy consumption can be reduced on the basis of improving the heat dissipation efficiency, meanwhile, the noise and vibration influences are avoided, and the invention is more suitable for the waterproof and dustproof use environment. The invention further discloses a server, and the beneficial effects of the server are as mentioned above.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a heat dissipation mechanism. The invention also relates to a server. Background technique [0002] With the advent of the 5G era, more massive data urgently require data processing and transmission methods with greater bandwidth, lower latency, and higher security levels. As a result, edge computing has emerged as the times require, and it is constantly landing in various usage scenarios. , such as industrial Internet, smart transportation, and autonomous driving, among which edge computing servers are the most important hardware devices and carriers for edge computing. [0003] Complex edge computing scenarios place higher requirements on the heat dissipation structure design of edge computing servers, such as dustproof, waterproof, salt spray resistance, and extremely high power consumption density. At present, there are usually three traditional heat dissipation structures ...

AI Technical Summary

Problems solved by technology

Among them, the immersion liquid-cooled heat dissipation structure is not suitable for the deployment of edge computing servers because it requires expensive cooling fluid and is difficult to maintain.

The cold plate liquid cooling heat dissipation structure mainly relies on the coolant flowing through the cold plate to absorb and take away the heat to achieve heat dissipation. Compared with the submerged heat dissipation structure, this heat dissipation structure is lower and more convenient to maintain. The energy consumption of the solution is large, and it is often only applicable to the heat dissipation of CPU, GPU and other modules. The heat dissipation of other heat-generating components still needs to be assisted by fans and other components. Therefore, in some environments with high waterproof and dustproof requirements , it is difficult to apply the traditional cold plate liquid cooling scheme

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