The utility model discloses a single-
station wafer thinning machine, which relates to the field of
wafer thinning machines and comprises a top plate, supporting rods are fixedly mounted at four corners of the bottom of the top plate, the bottoms of the supporting rods are fixedly mounted at four corners of the top of a
workbench, a fixed table is fixedly mounted in the middle of the top of the
workbench, and the fixed table is fixedly mounted at the bottom of the top of the
workbench. A positioning vacuum suction cup is installed in a cavity in the top of the fixing table, a
grinding motor is fixedly installed at the top in the cavity of the workbench, and the output end of the
grinding motor is connected with the fixing table. Mounting openings are correspondingly formed in the two ends of the top of the workbench, a water
retaining ring is arranged on the outer side of the top of the workbench, an electric telescopic rod is fixedly mounted at the bottom of the top plate, and a
grinding block is fixedly mounted at the bottom of the electric telescopic rod. The interior of the
wafer thinning machine is cleaned in time through the cleaning mechanism, waste materials polished by the
wafer thinning machine are cleaned away, and the situation that the
surface smoothness of the subsequent polished wafer is affected due to the fact that the waste materials fall on the subsequent to-be-polished wafer is prevented.