Hot pressing sintering machine for packaging high-power semiconductor device

A hot-pressing sintering and device packaging technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as waste of materials, poor contact, wire burnout, etc., to save maintenance time, improve work efficiency, avoid random swing effect

Inactive Publication Date: 2020-01-14
南安富诚阁工业设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Therefore, the PLC programmable controller has a great effect on the hot-press sintering machine, and the PLC programmable controller in the high-power equipment will often

Method used

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  • Hot pressing sintering machine for packaging high-power semiconductor device
  • Hot pressing sintering machine for packaging high-power semiconductor device
  • Hot pressing sintering machine for packaging high-power semiconductor device

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Embodiment

[0027] see Figure 1-Figure 6 , the present invention provides a hot-press sintering machine for high-power semiconductor device packaging, its structure includes a hot-press sintering machine 1, an inspection door 2, a machine door 3, a human-machine interface 4, and a radiator 5. The hot-press An inspection door 2 is provided on the front end of the sintering machine 1, and the hot pressing sintering machine 1 and the inspection door 2 are movably connected. The hot pressing sintering machine 1 is provided with a door 3 on the surface, and the hot pressing sintering machine 1 and The machine door 3 is connected by a hinge, a heat sink 5 is installed on the side of the hot pressing sintering machine 1, a human-machine interface 4 is arranged on the front surface of the hot pressing sintering machine 1, and the hot pressing sintering machine 1 consists of a body 1a, power supply device 1b, PLC programmable controller 1c, display 1d, and hot-pressing furnace 1e, the inside of t...

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Abstract

The invention discloses a hot pressing sintering machine for packaging a high-power semiconductor device. The structure comprises a hot pressing sintering machine, an overhaul door, a machine door, aman-machine interface and a heat radiator. The hot pressing sintering machine is composed of a machine body, a power supply device, a PLC programmable controller, a displayer and a hot pressing furnace. The PLC programmable controller can bind the wire through a wire harness mechanism so as to avoid misalignment of the wire caused by random wobbling of the wire. The wire is pressed on the conductive terminal by using the wire pressing wheel so as to avoid termination of working caused by poor contact due to the influence of external vibration on the wire during operation. When the wire is burnt out, the outer cover of the hot pressing sintering machine does not need to be disassembled and the wire does not need to be re-inserted. The servo motor drives the motor shaft to rotate, and the wire trapped under the bottom end is re-pushed into the bottom end of the wire pressing wheel by the wire feeding wheel on the motor shaft so as to save maintenance time, improve working efficiency andavoid damage to material processing.

Description

technical field [0001] The invention relates to the field of PLC programmable controllers, in particular to a hot pressing sintering machine used for packaging high-power semiconductor devices. Background technique [0002] With the rapid development of electricity, high-speed rail, and electric vehicles, the demand for high-power semiconductor devices has grown rapidly in recent years. High-power semiconductor devices have high power density and high heat generation, and their own requirements for heat dissipation are very high. And these are all done by hot-press sintering machine. The hot-press sintering machine is mainly controlled by temperature controller + voltage regulator + high-current transformer closed-loop control, automatic temperature tracking, all actions are completed by PLC, touch screen combined with PLC to complete all operations , and monitor the various operating conditions of the furnace in real time. The data of temperature, vacuum and displacement c...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 陈培容
Owner 南安富诚阁工业设计有限公司
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