Semiconductor image processing method and device, computer equipment and storage medium
An image processing and semiconductor technology, applied in the field of image processing, can solve the problems of low accuracy rate of automation solutions, failure to meet industrial-level large-scale application standards, missed detection or simplified operations, etc., to improve detection speed and reduce manual detection The effect of cost and time cost
Pending Publication Date: 2021-12-31
上海联麓半导体技术有限公司
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However, the above two types of methods have the following defects: 1) The manual-based method requires a lot of manual input in large-scale semiconductor production, and is greatly affected by the professional quality and sense of responsibility of the operators, so it is prone to missed inspections or Simplify work, etc.
2) The accuracy of automation solutions based on traditional image recognition algorithms is low, and cannot meet the standards for large-scale industrial applications
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[0054] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the application are given in the drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.
[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application. As used herein, the term "and / or" includes any and all couplings of one or more of the associated listed it...
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The invention relates to the technical field of image processing, in particular to a semiconductor image processing method and device, computer equipment and a storage medium. The semiconductor image processing method comprises the following steps: acquiring a to-be-processed semiconductor image; positioning the to-be-processed semiconductor image through a pre-trained semiconductor component processing model to obtain target area information, and cutting the to-be-processed semiconductor image according to the target area information to obtain sub-images; and performing defect identification on the obtained sub-images through a pre-trained semiconductor defect identification model to obtain defect information. According to the method, the to-be-processed semiconductor image is positioned based on the semiconductor component processing model to obtain the target area information, the sub-images are obtained through cutting, and then defect identification is performed on the sub-images through the semiconductor defect identification model to obtain the defect information, so that the detection speed, the detection accuracy and the stability of the detection result are effectively improved.
Description
technical field [0001] The present application relates to the technical field of image processing, in particular to a semiconductor image processing method, device, computer equipment and storage medium. Background technique [0002] As semiconductor devices shrink, semiconductor manufacturing processes become more and more complex. Semiconductor processes are becoming increasingly complex, requiring hundreds of sequential processing steps, and anomalies in the production process can jeopardize the performance and quality of the final chip. Therefore, in the semiconductor manufacturing process, there is an increasing need for fast, accurate, and sensitive detection of equipment and industrial faults to improve process yields and rapid fault classification of fault causes to minimize tool downtime. [0003] At present, the mainstream solutions for semiconductor fault detection are mainly divided into two types. The first type is to use manual identification, and the other is...
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IPC IPC(8): G06T7/00G06T7/73G06K9/62G06N3/04G06N3/08
CPCG06T7/0004G06T7/73G06N3/08G06T2207/10004G06T2207/20016G06T2207/20081G06T2207/20084G06T2207/20076G06N3/047G06N3/045G06F18/241G06F18/2415G06F18/253
Inventor 曾锃邹骁锋陈岑李扬帆
Owner 上海联麓半导体技术有限公司