Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer coating device and face-down type wafer carrying assembly thereof

A technology of wafer carrying and coating equipment, which is applied in the direction of electrical components, conveyor objects, gaseous chemical plating, etc.

Pending Publication Date: 2022-01-07
ASTI GLOBAL INC
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The temperature control module is adjacent to the magnetic force generation module

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer coating device and face-down type wafer carrying assembly thereof
  • Wafer coating device and face-down type wafer carrying assembly thereof
  • Wafer coating device and face-down type wafer carrying assembly thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0019] refer to figure 1 and figure 2 As shown, the first embodiment of the present invention provides a face-down wafer carrier assembly S, the face-down wafer carrier assembly at least includes: a magnetic force generation module 1, a temperature control module 2 and a magnetizable Module 3. Furthermore, the temperature control module 2 is adjacent to the magnetic force generating module 1 , and the magnetizable module 3 is disposed on the temperature control module 2 . In addition, the magnetizable module 3 includes a high temperature resistant magnetizable metal plate 31 and at least one high temperature resistant viscous layer 32, the high temperature resistant magnetizable metal plate 31 is arranged on the temperature control module 2, and the high temperature resistant viscous layer 32 is arranged on the On the high temperature resistant magnetizable metal plate 31.

[0020] For example, if figure 1 or figure 2 As shown, the magnetic force generating module 1 inc...

no. 2 example

[0027] refer to Image 6 and Figure 7 As shown, the second embodiment of the present invention provides a face-down wafer carrier assembly S. Depend on Image 6 and Figure 7 respectively with figure 1 and figure 2 Comparison shows that the biggest difference between the second embodiment of the present invention and the first embodiment is: in the second embodiment, the magnetic force generating module 1 includes a permanent magnetic structure 11B and a cooling structure 13 contacting the permanent magnetic structure 11B. That is to say, since the permanent magnetic structure 11B can generate magnetic force without a power supply, the face-down wafer carrier assembly S provided in the second embodiment can omit the use of a power supply.

[0028] It should be noted that the second embodiment of the present invention further provides a wafer coating device (not shown). The wafer coating equipment uses the face-down wafer carrier assembly S of the second embodiment, and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

A wafer coating device and a face-down type wafer carrying assembly thereof are provided. The face-down type wafer carrying assembly includes a magnetic force generating module, a temperature control module, and a magnetizable module. The temperature control module is adjacent to the magnetic force generating module. The magnetizable module is disposed on the temperature control module. The magnetizable module includes a high-temperature magnetizable metal plate disposed on the temperature control module. When at least one wafer is temporarily adhered to the adhesive bottom surface of the high-temperature adhesive layer, a prepared surface of the at least one wafer can face downwardly by adhering of the adhesive bottom surface of the high-temperature adhesive layer, so that the face-down type wafer carrying assembly can be applied to solve the problem that the prepared surface of the wafer would be dirtied by falling particles due to gravity.

Description

technical field [0001] The invention relates to a coating device and its carrying assembly, in particular to a wafer coating device and its face-down wafer carrying assembly. Background technique [0002] In the prior art, a face-up deposition design is usually adopted in MOCVD (metal organic chemical vapor deposition) equipment (the surface of the wafer to be deposited will face upward), and the MOCVD equipment can operate at a temperature higher than 900 ° C. Metal-organic materials are coated on the wafer. However, for this face-up deposition design, particles falling due to gravity will inevitably contaminate the surface of the wafer, so this shortcoming urgently needs to be overcome. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a wafer coating device and its face-down wafer carrying assembly in view of the deficiencies in the prior art. [0004] In order to solve the above-mentioned technical problems, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/458H01J37/32
CPCC23C16/4583C23C16/4585C23C16/4581H01J37/32724H01L21/6715H01L21/67248H01L21/67103H01L21/68785H01L21/67109H01L21/68757H01L21/6831H01F7/0247H01F7/20B65G47/92H01F7/0257H01L21/67733C23C16/46C23C16/4401C23C16/52
Inventor 廖建硕
Owner ASTI GLOBAL INC