Active heat dissipation cooling method for packaged semiconductor

Abstract

The invention relates to an active heat dissipation and cooling method for a packaged semiconductor, belongs to the field of heat dissipation and cooling of semiconductors, and solves the problems that in an existing semiconductor heat dissipation technology, heat transfer is not timely, part of heat is left in the surrounding environment of the semiconductor, and the semiconductor is in a high-temperature environment. According to the scheme, the semiconductor and the heat dissipation mechanism are separated through the heat transfer mechanism, heat dissipated by the heat dissipation mechanism to the outside cannot flow back to the periphery of the semiconductor, the semiconductor is located in an environment with the moderate temperature, and the heat dissipation effect is better. In addition, the heat transfer mechanism transfers heat through vaporization and liquefaction of the liquid medium with the easy-to-evaporate property, the heat generated during work of the semiconductor can be transferred to the heat dissipation mechanism more quickly, namely, the heat on the semiconductor is transferred away more quickly, the heat dissipation efficiency is not affected, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to the field of semiconductor heat dissipation and cooling, and in particular to an active heat dissipation and cooling method for packaging semiconductors. Background technique [0002] In the prior art, semiconductors are generally dissipated in the way of fan cooling. This cooling method has the following disadvantages: the heat transfer is not timely, and part of the heat will remain in the surrounding environment of the semiconductor, so that the semiconductor is in a relatively low temperature environment. In a high-temperature environment, the longer the semiconductor works, the higher the ambient temperature until it reaches an equilibrium point. In short, the temperature around the semiconductor will be higher than the normal temperature outside, which will affect the smoothness of the semiconductor. Therefore, the present invention proposes an active heat dissipation and cool...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that in the existing semiconductor heat dissipation technology, the heat transfer is not timely, and part of the heat will remain in the environment around the semiconductor, so that the semiconductor is in a higher temperature environment. method

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