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A circuit substrate for new energy vehicles and its preparation method
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A technology for new energy vehicles and circuit substrates, applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve problems such as high linear expansion coefficient of circuit substrates, reduced service life of circuit substrates, cracking and damage of circuit substrate chips, etc., to achieve Reduce production costs, prolong service life, and quickly dissipate heat
Active Publication Date: 2022-06-07
ZHUHAI YUEKE JINGHUA TECH
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[0002] With the rapid development of new energy vehicles, the number of circuit substrates used in new energy vehicles has gradually increased. There are multiple silicon chips on the circuit substrate. At present, the circuit substrate generally uses metal materials such as copper substrates and aluminum substrates as substrates. The linear expansion coefficient of the circuit substrate is relatively high, and there is a large difference between the linear expansion coefficient of the metal circuit substrate and the silicon chip. Since the circuit substrate for new energy vehicles often works in a high temperature environment, the deformation of the metal circuit substrate is relatively large after being heated. Large, stress concentration is prone to occur during use and the chip on the surface of the circuit substrate is cracked and damaged, which reduces the service life of the circuit substrate and increases the cost of new energy vehicles
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Embodiment 1
[0058] Embodiments of the present invention provides a circuit substrate for new energy vehicles, such as Figure 1-6Shown, comprising: circuit substrate body 1, the circuit substrate body 1 is made of powder, composite sintering additive, dispersant, plasticizer, binder uniformly mixed, the powder is prepared from the following mass percentages of each component: 70%-95% aluminum nitride, 5%-30% silicon nitride.
[0059] The working principle and beneficial effects of the above technical solution are: In the present invention, the circuit substrate body 1 is prepared by a powder, a composite sintering aid, a dispersant, a plasticizer, a binder evenly mixed, the powder is prepared from the following mass percentages of each component: 70%-95% aluminum nitride, 5%-30% silicon nitride, the circuit substrate body 1 by adding silicon nitride, can improve the linear expansion coefficient of the circuit substrate body 1, So that the circuit substrate body 1 line expansion coefficient and...
Embodiment 2
[0061] On the basis of the above-described Example 1, e.g., Figure 1-6 As shown, the circuit substrate body 1 is provided with a number of ventilation holes 2, the upper and lower ends of the ventilation hole 2 are respectively through the upper surface and lower surface of the circuit substrate body 1;
[0062] The ventilation holes 2 are distributed in an array;
[0063] The thermal conductivity of the circuit substrate body 1 is not less than 24.5W / m*K;
[0064] The sintering additive consists of alkali metal oxides, alkaline earth oxides and rare earth metal oxides.
[0065] The working principle and beneficial effects of the above technical scheme are: the circuit substrate body 1 is set in the ventilation hole 2, which can improve the heat dissipation speed of the circuit substrate, avoid the components on the surface of the circuit substrate body 1 working at high temperatures for a long time, the thermal conductivity of the circuit substrate body 1 is not less than 24.5W / m...
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Abstract
The invention provides a circuit substrate for new energy vehicles and a preparation method thereof, comprising: a circuit substrate body, and the circuit substrate body is prepared by uniformly mixing powder, composite sintering aid, dispersant, plasticizer, and binder The powder is prepared from the following components in mass percentage: 70%-95% aluminum nitride, 5%-30% silicon nitride. The linear expansion coefficient of the circuit substrate body provided by the present invention is similar to that of the silicon material chip, which can avoid the problem of cracking of the chip on the circuit substrate during use, and at the same time, the circuit substrate has high thermal conductivity and can quickly dissipate heat. The service life of the chip and the circuit substrate is prolonged, the stability of the circuit substrate is increased, and the production cost is reduced.
Description
Technical field [0001] The present invention relates to the field of circuit substrate technology for new energy vehicles, in particular to a circuit substrate for new energy vehicles and a preparation method thereof. Background [0002] With the rapid development of new energy vehicles, the circuit substrate for new energy vehicles has gradually increased, the circuit substrate is provided with a plurality of silicon chips, the current circuit substrate generally uses copper substrates, aluminum substrates and other metal materials as substrates, the circuit substrate lines made of metal materials have a higher expansion coefficient, and the circuit substrates made of metal materials and the linear expansion coefficient of silicon chips are more different, because the circuit substrates for new energy vehicles often work in a high temperature environment, and the circuit substrates of metal materials are deformed after heating. In the process of use, it is easy to cause the chip...
Claims
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