DDR signal quality auxiliary test fixture and test method

Abstract

The invention discloses a DDR signal quality auxiliary test fixture and a test method, the fixture comprises a substrate and a connecting plate, one side of the substrate is welded with DDR particles, and the other side of the substrate is provided with solder balls connected with the DDR particles; the connecting plate is detachably mounted on a main board, a plurality of probes are arranged on the connecting plate, one end of each probe is connected with the main board, and the other end of each probe is in one-to-one correspondence contact with one solder ball on a substrate; and the connecting plate is also provided with a clamping assembly which is used for clamping the DDR particles and the substrate on the connecting plate. The fixture has the advantages of being simple in structure, easy and convenient to disassemble and assemble, reusable and the like.

Description

technical field [0001] The invention mainly relates to the technical field of DDR board-mounted particle testing, in particular to a DDR signal quality auxiliary testing fixture and testing method. Background technique [0002] The on-board ddr signal quality test mainly measures the quality of the DDR signal channel of the PCB motherboard with an oscilloscope, and leads the signal through the DDR substrate to intercept the waveform closest to the DDR signal channel. For the prior art, the front and back sides of the DDR substrate are respectively welded to the DDR particles and the main board under test through pads. Since the substrate is directly welded and the substrate is a multi-layer buried resistance board, after the soldering is removed, the impedance of the substrate will be affected, resulting in that the substrate is almost disposable and cannot be used multiple times. Since the unit price of the substrate is relatively high, if there are many motherboards to be...

AI Technical Summary

Problems solved by technology

Due to the way of direct welding, the substrate is a multi-layer buried resistance board. After the welding is removed, the impedance of the substrate will be affected, resulting in that the substrate is almost disposable and cannot be used multiple times.

Due to the relatively high unit price of the substrate, if there are many motherboards to be tested, the substrate will cause huge cost waste

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