This invention provides a
semiconductor device and its fabrication method, comprising the following steps: providing a substrate; forming a
carbon nanotube layer on the substrate, the
carbon nanotube layer having at least one
carbon nanotube; forming a defect structure in contact with the carbon
nanotube layer, the defect structure containing charged defects, the charged defects acting on the carbon
nanotube layer to electrically dope the carbon
nanotube layer; wherein, the electrical
doping concentration of the carbon nanotubes is controlled by adjusting the density of the charged defects. In this invention, electrical
doping of the carbon nanotube layer through the defect structure only changes the electrical properties of the carbon nanotube layer without damaging its
physical structure, achieving non-destructive electrical
doping. Furthermore, using a high
work function metal layer as the source and drain electrodes of the N-type carbon nanotube device simplifies the design rules of carbon nanotube integrated circuits, facilitates the large-scale
integrated circuit application of carbon nanotube devices, and enables the matching of N-type and P-type devices.