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A surface acoustic filter packaging structure

A surface acoustic filter and packaging structure technology, applied in the field of filters, can solve problems such as easy breakage of solder joints, and achieve the effects of preventing breakage, reducing displacement amplitude, and improving damage resistance

Active Publication Date: 2022-04-01
深圳新声半导体有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention provides a surface acoustic filter packaging structure, which is used to solve the problem that the solder joint between the chip and the substrate in the existing filter is easy to break, and the technical solution adopted is as follows:

Method used

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  • A surface acoustic filter packaging structure
  • A surface acoustic filter packaging structure
  • A surface acoustic filter packaging structure

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Embodiment Construction

[0024] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0025] A surface acoustic filter packaging structure proposed by the embodiment of the present invention, such as figure 1 As shown, the package structure includes a base body; two colloid grooves and a metal wire layer are arranged inside the base body; the two colloid grooves communicate with the metal wire layer; the metal wire layer extends to the base body inside the base body The outer surface of the bottom is electrically connected to the solder ball at the bottom of the substrate; the outer surface of the bottom of the substrate is provided with a passivation layer; the two colloid grooves are filled with conductive glue; the conductive glue and the metal wir...

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Abstract

The invention provides a package structure of a surface acoustic filter. The packaging structure includes a base; the base is provided with two colloid grooves and a metal wire layer; the two colloid grooves communicate with the metal wire layer; Solder balls are electrically connected; conductive glue is poured into the two colloid grooves; the conductive glue is connected to the metal wire layer; the upper surface of the conductive glue is higher than the upper surface of the substrate; and the conductive glue A solder joint support is bonded to it; a chip is provided on the solder joint support; a gap is formed between the chip, the substrate and two solder joint support columns, and the IDT functional area of ​​the chip is set in the gap ; The upper surface of the substrate is provided with two connection plates; the connection plate is provided with a hollow glass support column; the two ends of the chip are embedded in the hollow glass support column; the filter chip is provided with a cover plate; the cover plate is bonded to the base body.

Description

technical field [0001] The invention provides a package structure of a surface acoustic filter, which belongs to the technical field of filters. Background technique [0002] At present, the main packaging technologies of surface acoustic filters include metal packaging, plastic packaging, surface mount, flip-chip welding and other substrate packaging or the use of device surface film packaging. The existing packaging structure of this type of filter has the following disadvantages: since the connection between the chip and the substrate needs to be strengthened by solder joints, but since there must be a gap between the chip and the substrate, this requires the solder joints to have a certain height. When there is a height, when there is an external force between the chip and the substrate, it will cause the solder joints to crack, which will affect the filter performance. Although in the prior art, the solder joints are lowered into the tank through the tank structure to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/02H03H9/05H03H9/10
CPCH03H9/02543H03H9/02614H03H9/0538H03H9/1064
Inventor 王玉丽袁婷
Owner 深圳新声半导体有限公司
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