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Light source device, preparation method of light source device and display equipment

A device and light source technology, which is applied in the field of light source device preparation, display equipment, and light source devices, can solve the problems of large package size and cannot be reduced, and achieve the effect of more miniaturization of monomer size and improved luminous brightness

Pending Publication Date: 2022-01-18
弘凯光电(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a light source device, a method for preparing a light source device, and a display device, aiming to solve the problem that the existing light source body has a large package size and cannot be reduced

Method used

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  • Light source device, preparation method of light source device and display equipment
  • Light source device, preparation method of light source device and display equipment
  • Light source device, preparation method of light source device and display equipment

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Embodiment Construction

[0031] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0032] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0033] In the description of the present application, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative im...

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PUM

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Abstract

The invention belongs to the technical field of display, and provides a light source device, a preparation method of the light source device and display equipment. The light source device comprises a driving chip, at least one LED chip set, a circuit line layer, a channel wire, a first metal bonding pad and a second metal bonding pad, wherein the first metal bonding pad is arranged on the first surface of the driving chip, the circuit line layer and the second metal bonding pad are arranged on the second surface of the driving chip, the side surface of the driving chip is provided with the channel wire used for connecting the circuit line layer and the first metal bonding pad, and the LED chip set is arranged on the second surface of the driving chip and connected with the second metal bonding pad; and the channel wire is arranged on the side surface of the driving chip to connect the circuit line layer and the first metal bonding pad on the two surfaces of the driving chip, the size of the light source device is reduced, and the problem that the size of a packaging body of an existing light source body is large and cannot be reduced is solved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a light source device, a method for preparing the light source device, and a display device. Background technique [0002] In the display market, with the rapid development of technology, transparent displays have become the mainstream devices used in emerging markets, and the main components of transparent displays are integrated light sources including driver chips and LED (light-emitting diode) chips Body, the existing LED light source body uses the vertical structure packaging technology to fix the driver chip on the circuit carrier in a flip-chip manner, fix and glue the front-emitting LED chip directly above the driver chip, and then pass The LED chip is electrically connected with the driver chip and the circuit carrier by welding the conduction wire, so as to realize the driving of the integrated LED light source body. [0003] However, the above-mentioned des...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L33/62H01L33/54G09F9/33G09G3/32
CPCH01L25/167H01L33/62H01L33/54G09G3/32G09F9/33H01L2933/0033H01L2933/0066
Inventor 龙成海廖本瑜黄建中
Owner 弘凯光电(江苏)有限公司
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